GE Grid Solutions BAI11 369B1868G5002

Technical Dossier

Product Details And Specifications

GE BAI11 Series Technical Notes

The Evolution of BAI11 Architecture

The BAI11 designation refers to a bay-level analog input module within GE's numerical protection relay platform. Early iterations of this architecture were introduced in the late 1990s as GE transitioned from electromechanical to numerical relay technology. The first-generation modules used parallel backplane communication and were compatible with GE's SR series relay chassis. By the mid-2000s, the BAI11 family was re-engineered to support high-speed serial backplane buses, enabling deterministic scan times below 1 ms for protection-critical analog acquisition channels.

The 369B1868G5002 variant represents a mature revision within the BAI11 lineage, incorporating enhanced EMC shielding and extended operating temperature tolerance (-20°C to +70°C), making it suitable for outdoor switchgear enclosures in harsh climates. Compatibility with legacy chassis requires verification of firmware revision levels; modules with firmware below Rev. 4.x may require a bootloader update before integration into systems running IEC 61850 Edition 2 configurations. Successor platforms include GE's Universal Relay (UR) series Type 2 I/O modules, which provide a migration path for end-of-life BAI11 installations while maintaining functional equivalence for current transformer (CT) and voltage transformer (VT) analog inputs.

BAI11 Full Catalog & Functionalities (SKU List)

The following catalog covers verified BAI11-series and directly associated GE protection module SKUs. Each entry reflects a distinct hardware configuration or revision level.

Analog Input Modules (AI)

• BAI11 369B1868G5002: Bay analog input module, 8-channel CT/VT acquisition, Rev. G5002 backplane variant
• BAI11 369B1868G5001: Bay analog input module, 8-channel CT/VT acquisition, Rev. G5001 standard backplane
• BAI11 369B1868G5003: Bay analog input module, extended temperature range, enhanced EMC shielding
• BAI11 369B1868G5004: Bay analog input module, high-accuracy metering grade, 0.2S class CT inputs
• BAI11 369B1868G5005: Bay analog input module, dual-redundant power supply input configuration

Digital Input Modules (DI)

• BDI11 369B1869G5001: Bay digital input module, 16-channel opto-isolated, 24–250 VDC/VAC universal threshold
• BDI11 369B1869G5002: Bay digital input module, 32-channel high-density, IEC 61850 GOOSE-mapped
• BDI11 369B1869G5003: Bay digital input module, fast binary input, <1 ms response for protection interlocking

Digital Output Modules (DO)

• BDO11 369B1870G5001: Bay digital output module, 8 trip-rated relay outputs, 30 A make / 5 A carry
• BDO11 369B1870G5002: Bay digital output module, 16 signal relay outputs, Form C contacts
• BDO11 369B1870G5003: Bay digital output module, solid-state output variant, 50 ms max operate time

Communication & CPU Modules

• BCU11 369B1871G5001: Bay control unit, IEC 61850 Ed.1 GOOSE/MMS, dual Ethernet ports
• BCU11 369B1871G5002: Bay control unit, IEC 61850 Ed.2, IEEE 1588 PTP time synchronization
• BCU11 369B1871G5003: Bay control unit, SCADA gateway variant, DNP3 + IEC 60870-5-104 dual protocol

Power Supply Modules

• BPS11 369B1872G5001: Bay power supply module, 110/220 VDC input, 24 VDC/5 A regulated output
• BPS11 369B1872G5002: Bay power supply module, redundant hot-swap configuration, N+1 architecture
• BPS11 369B1872G5003: Bay power supply module, wide-range AC/DC input, 85–265 VAC / 88–300 VDC

Quality Control for the BAI11 Range

BAI11 modules present specific test challenges due to their multi-channel analog acquisition architecture and backplane-dependent communication protocol. DriveKNMS applies the following test protocol to all BAI11 units prior to dispatch:

• Backplane bus integrity test: Each module is seated in a GE-compatible test chassis and subjected to full backplane communication verification, confirming error-free data exchange at rated scan rates.
• Analog channel calibration verification: All CT and VT input channels are tested against NIST-traceable reference signals at 50 Hz and 60 Hz to confirm amplitude accuracy within ±0.5% of rated input.
• Opto-isolator threshold test: For DI-type modules, binary input thresholds are verified across the full rated voltage range (24–250 VDC) to confirm correct pick-up and drop-off levels.
• Thermal cycling: Units are subjected to a 4-hour thermal cycle between -10°C and +60°C to identify latent solder joint failures common in aged PCB assemblies.
• Firmware revision audit: Installed firmware is read and documented. Modules with firmware below minimum compatible revision are flagged and updated where applicable.
• 72-hour burn-in: All modules undergo continuous powered operation for 72 hours under simulated load conditions before final inspection and packaging.