GE Fanuc Series 90-30 Model guide / RFQ route

GE Fanuc Series 90-30 PROFIBUS Modules: IC693PBM200

Model: IC693PBM200

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Brand GE Fanuc
Series Series 90-30
Model IC693PBM200
RFQ-ready model route Obsolete and surplus sourcing Export follow-up by model list

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Technical Dossier

Product Details And Specifications

GE Fanuc Series 90-30 Series Technical Notes

The GE Fanuc Series 90-30 PLC platform is one of the most widely deployed modular programmable logic controller architectures in global heavy industry. Installed across petrochemical refineries, nuclear power generation facilities, offshore platforms, and continuous-process chemical plants, the Series 90-30 established a benchmark for mid-range industrial control in the 1990s and 2000s. Its rack-based, backplane-bus architecture supports mixed I/O, communication, and specialty modules within a single chassis, enabling high-density control configurations with deterministic scan performance. The IC693PBM200 is a PROFIBUS-DP Master module designed for this platform, enabling the Series 90-30 CPU to act as a Class 1 PROFIBUS master, polling up to 125 slave devices on a single DP network segment at data rates up to 12 Mbps. This module is critical in facilities where PROFIBUS-DP is the fieldbus standard for distributed I/O, drives, and instrumentation.

The Evolution of Series 90-30 Architecture

The Series 90-30 was introduced by GE Fanuc Automation in the early 1990s as a successor to the Series Six and Series Five platforms. Its architecture is built around a passive backplane with a proprietary parallel bus, supporting up to 10 modules per rack and multiple expansion racks via the Bus Expansion Module (BEM) interface. Early CPU modules (IC693CPU311, IC693CPU313) offered limited memory and no embedded Ethernet; subsequent generations (IC693CPU364, IC693CPU374) added 10/100 Ethernet ports and expanded program memory to 240 KB. The communication module ecosystem evolved in parallel: early serial adapters (IC693CMM301, IC693CMM302) gave way to PROFIBUS (IC693PBM200), DeviceNet (IC693DNM200), and Ethernet Global Data (EGD) modules. Compatibility across generations is constrained by firmware revision and CPU model; the IC693PBM200 requires CPU firmware 9.0 or later and is not compatible with the earliest IC693CPU311 hardware revisions. As the Series 90-30 has entered its end-of-life phase (GE/Emerson discontinued active development circa 2015–2018), the installed base remains substantial, and long-term maintenance sourcing is the primary procurement driver for this platform.

Series 90-30 Full Catalog & Functionalities (SKU List)

CPU Modules

  • IC693CPU311: 6 KB program memory, 512 I/O points, no Ethernet, base CPU for small applications.
  • IC693CPU313: 12 KB program memory, 1024 I/O points, serial port, entry-level mid-range CPU.
  • IC693CPU321: 32 KB program memory, 2048 I/O points, enhanced instruction set.
  • IC693CPU331: 32 KB program memory, floating point math, expanded I/O capacity.
  • IC693CPU340: 240 KB program memory, embedded Ethernet, EGD support, high-performance CPU.
  • IC693CPU350: 240 KB program memory, dual Ethernet ports, enhanced diagnostics.
  • IC693CPU364: 240 KB program memory, embedded 10/100 Ethernet, SRTP protocol support.
  • IC693CPU374: 240 KB program memory, embedded Ethernet, high-speed counter support, top-tier Series 90-30 CPU.

Communication & Network Modules

  • IC693PBM200: PROFIBUS-DP Class 1 Master module; supports up to 125 slaves, 12 Mbps max data rate, GSD-based configuration.
  • IC693DNM200: DeviceNet Master/Slave module; supports up to 64 nodes, explicit and I/O messaging.
  • IC693CMM301: Serial Communications module; RS-232/RS-485, supports SNP, SNP-X, RTU Modbus protocols.
  • IC693CMM302: Dual-port serial communications; two independent RS-232/RS-485 channels.
  • IC693BEM320: Bus Expansion Master; connects primary rack to up to 7 expansion racks.
  • IC693BEM321: Bus Expansion Slave; installed in expansion rack, pairs with IC693BEM320.

Discrete I/O Modules

  • IC693MDL340: 24 VDC Discrete Input, 16-point, positive logic, standard density DI module.
  • IC693MDL341: 24 VDC Discrete Input, 32-point, high-density DI module.
  • IC693MDL390: 120 VAC Discrete Input, 16-point, isolated inputs.
  • IC693MDL740: 24 VDC Discrete Output, 16-point, 0.5 A per point, positive logic DO module.
  • IC693MDL741: 24 VDC Discrete Output, 32-point, high-density DO module.
  • IC693MDL930: Relay Output, 16-point, Form A contacts, 2 A per point, for high-current switching.

Analog I/O Modules

  • IC693ALG220: Analog Input, 4-channel, 4–20 mA / 0–10 V, 12-bit resolution.
  • IC693ALG221: Analog Input, 8-channel, 4–20 mA / 0–10 V, 12-bit resolution, high-density AI.
  • IC693ALG390: Analog Output, 2-channel, 4–20 mA / 0–10 V, 12-bit resolution.
  • IC693ALG391: Analog Output, 4-channel, 4–20 mA / 0–10 V, 12-bit resolution.

Power Supply Modules

  • IC693PWR321: 120/240 VAC input power supply, 30 W output, standard rack PSU.
  • IC693PWR322: 24 VDC input power supply, 30 W output, for DC-powered installations.
  • IC693PWR330: 120/240 VAC input, 40 W output, high-capacity rack power supply.

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