GE Grid Solutions UR9EV CPU Module

Technical Dossier

Product Details And Specifications

GE UR Series Technical Notes

The Evolution of UR Series Architecture

The UR platform was introduced in the late 1990s as GE Multilin's response to the industry demand for a unified, IED-based (Intelligent Electronic Device) protection relay that could replace discrete electromechanical and solid-state relays across multiple protection functions. The original UR chassis established a 19-inch rack-mount form factor with a passive backplane bus, allowing modular slot-based population of function cards.

Early UR firmware (pre-v4.x) operated on proprietary real-time OS kernels with limited SCADA integration. The introduction of IEC 61850 GOOSE messaging support in the v5.x firmware generation marked a significant architectural shift, enabling peer-to-peer relay communication without hardwired I/O. Subsequent generations added DNP3, Modbus RTU/TCP, and IEC 60870-5-104 protocol stacks, making the UR platform compatible with virtually all SCADA and EMS architectures in service today.

The UR9EV CPU module represents the current-generation processing core, featuring enhanced DSP performance for high-speed phasor measurement and fault recording. Compatibility between UR chassis generations requires attention to backplane revision levels; early Type A chassis are not electrically compatible with Type B/C backplanes without adapter hardware. Firmware cross-compatibility between CPU generations is managed through GE's EnerVista UR Setup software, which enforces version-locked configuration files.

UR Series Full Catalog & Functionalities (SKU List)

The following SKUs represent verified, commonly stocked modules within the GE UR Series platform, organized by functional category:

CPU & Processing Modules

• UR9EV: Current-generation CPU module; dual-core DSP; IEC 61850 Ed.2 compliant; primary processing core for all UR relay types.
• UR9E: Standard CPU module; single DSP core; supports DNP3, Modbus, IEC 61850 Ed.1; predecessor to UR9EV.
• UR9F: High-performance CPU variant; extended memory for large configuration databases and oscillography storage.
• UR6H: Legacy CPU module for early-generation UR chassis; limited protocol support; no IEC 61850 native stack.

Digital Input (DI) Modules

• UR8AH: 24-channel digital input module; 24/48 VDC wet contact sensing; opto-isolated inputs.
• UR8AJ: 24-channel digital input module; 110/125 VDC wet contact sensing; high-voltage industrial environments.
• UR8AK: 24-channel digital input module; 220/250 VDC wet contact sensing; substation battery bus compatible.
• UR8AL: 16-channel digital input module; AC voltage sensing inputs; 120/240 VAC rated.

Digital Output (DO) / Analog Output Modules

• UR8BH: 16-channel form-A output module; 30 VDC / 250 VAC rated contacts; trip and control duty.
• UR8BJ: 8-channel form-C output module; high-current contacts; 10 A continuous rating.
• UR8BK: 4-channel analog output module; 4–20 mA current loop; metering and SCADA retransmission.

Analog Input (AI) / CT-VT Modules

• UR8CH: 8-channel CT/VT input module; 1 A / 5 A CT selectable; 120/240 VAC VT inputs.
• UR8CJ: 4-channel CT input module; high-accuracy metering class; 0.1% accuracy at rated current.
• UR8CK: 8-channel VT input module; 69 kV / 115 kV / 230 kV VT secondary compatible.

Communications & Networking Modules

• UR8DH: Dual-port Ethernet communications module; 100BASE-TX; IEC 61850, DNP3/TCP, Modbus/TCP.
• UR8DJ: Fiber optic communications module; ST connector; inter-relay GOOSE and direct I/O transfer.
• UR8DK: RS-485 serial communications module; Modbus RTU, DNP3 serial; legacy SCADA integration.

Power Supply Modules

• UR8EH: Standard power supply module; 125/250 VDC input; 20 W output; standard UR chassis.
• UR8EJ: Redundant power supply module; dual-input hot-swap capable; mission-critical substation applications.

Quality Control for the UR Series Range

The UR Series backplane employs a proprietary high-speed serial bus for inter-module communication. Verification of module integrity therefore requires not only standalone component testing but also in-chassis bus communication validation. DriveKNMS applies the following test protocol to all UR Series modules:

• Visual inspection: PCB condition, connector pin integrity, capacitor health assessment.
• Power-on self-test (POST) verification: Module boot sequence monitored via EnerVista UR Setup software; firmware version and hardware revision confirmed.
• Backplane bus communication test: Module installed in reference UR chassis; inter-module data exchange verified at rated bus speed.
• I/O functional test: For DI modules — wet contact sensing verified at rated voltage. For DO modules — contact resistance and trip current verified. For CT/VT modules — accuracy verified against calibrated reference signals.
• Thermal soak: 4-hour burn-in at 50°C ambient to screen latent component failures.
• Final configuration wipe: All test configurations cleared; module returned to factory-default state prior to shipment.