ICS Triplex T3401 Trusted Series Modules

Technical Dossier

Product Details And Specifications

ICS Triplex Trusted Series Technical Notes

The Evolution of Trusted Series Architecture

ICS Triplex introduced the Trusted platform in the early 1990s as a successor to its earlier TMR designs, targeting SIL 3 applications that required certified hardware redundancy without reliance on software voting alone. The original T8000-series chassis established the backplane architecture: three independent processing lanes (A, B, C) with continuous cross-comparison and automatic fault isolation. Each I/O module communicates over a triplicated internal bus, ensuring that a single-point hardware failure in any lane does not propagate to the process output.

The T3000-series field I/O modules — including the T3401 Digital Input and T3480 Digital Output — were introduced as the primary field interface layer for this architecture. These modules mount directly onto T8110 baseplates and communicate with the TMR processor via the triplicated backplane bus. The design philosophy prioritized deterministic fault detection: each channel is independently monitored across all three lanes, with disagreement triggering automatic lane isolation rather than a system trip.

Trusted Series Full Catalog & Functionalities (SKU List)

The following SKUs represent verified, real-world part numbers from the ICS Triplex Trusted platform installed base. Modules are classified by functional category.

Digital Input (DI) Modules

• T3401: 24 VDC DI, 32-channel, TMR-voted, field-wiring via T8110 baseplate, SIL 3.
• T3411: 120 VAC DI, 16-channel, optically isolated, for high-voltage field devices.
• T3420: 24 VDC DI with enhanced per-channel diagnostics, SIL 3 rated.
• T3422: 24 VDC DI, 32-channel, NAMUR sensor compatible, intrinsically safe interface.

Digital Output (DO) Modules

• T3480: 24 VDC DO, 16-channel, solid-state relay output, TMR voted.
• T3481: 120 VAC DO, 8-channel, for solenoid valve and actuator drive applications.
• T3484: 24 VDC DO, 8-channel, high-current output, for large solenoid loads.

Analog Input (AI) Modules

• T8403: AI, 8-channel, 4–20 mA, 12-bit resolution, HART-transparent.
• T8431: AI, 16-channel, ±10 V / 4–20 mA configurable, high-density I/O.
• T8461: TC/RTD Input, 8-channel, supports J/K/T/E thermocouple and PT100 RTD.
• T8462: RTD Input, 16-channel, PT100/PT1000, for temperature-critical process loops.

Analog Output (AO) Modules

• T8480: AO, 8-channel, 4–20 mA, 12-bit, for control valve positioner drive.
• T8482: AO, 4-channel, 4–20 mA, high-accuracy, for precision flow control applications.

CPU / Controller Modules

• T8110: Trusted Controller baseplate; primary chassis interface for I/O module mounting and backplane bus.
• T8151B: Trusted Processor module; TMR CPU, 32 MB RAM, executes IEC 61131-3 safety logic.
• T8110B: Redundant Power Supply module; 24 VDC input, triplicated internal rails, hot-swap capable.

Communication & Network Modules

• T8800: Trusted Communication Interface; Ethernet TCP/IP gateway for DCS historian and HMI integration.
• T9432: Profibus DP Communication module; master/slave configurable, for field device integration.
• T9451: Modbus RTU/TCP Communication module; serial and Ethernet dual-port, legacy DCS interfacing.
• T9802: EtherNet/IP Adapter module; CIP-compliant, for integration with Rockwell ControlLogix supervisory systems.

Power Supply Modules

• T8120: AC/DC Power Supply; 120/240 VAC input, 24 VDC output, for chassis power distribution.
• T8121: DC/DC Power Supply; 48 VDC input, 24 VDC output, for telecom-standard power environments.

Quality Control for the Trusted Series Range

The Trusted platform's TMR architecture introduces specific test requirements that differ from standard PLC module verification. Each module contains three independent processing lanes whose cross-comparison logic must be validated under both normal and fault-injected conditions. DriveKNMS applies the following test protocol to all Trusted series modules prior to dispatch:

• Backplane bus continuity verification across all three lanes using dedicated Trusted chassis test fixtures.
• Channel-by-channel signal injection and readback for all DI, DO, AI, and AO modules at rated voltage and current.
• Fault injection test: deliberate single-lane failure simulation to confirm TMR voting logic and automatic fault isolation behavior.
• Communication module validation: protocol handshake verification (Profibus DP, Modbus RTU/TCP, EtherNet/IP) using dedicated protocol analyzers.
• 48-hour burn-in cycle under powered operation at ambient temperature prior to final inspection and packaging.
• Serial number recording and test record retention; documentation available to customers upon request.