Kontron ASMC Series Modules ASMC2177G

Model: ASMC2177G

Brand Kontron
Series ASMC Series
Model ASMC2177G
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Product Overview

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Technical Dossier

Product Details And Specifications

Kontron ASMC Series Technical Notes

The Evolution of ASMC Architecture

The ASMC architecture is built on Kontron's CompactPCI and PICMG-compliant backplane standards, evolving through several generations of processor and bus technology. Early ASMC modules utilized Intel x86 single-board computer architectures with ISA/PCI bus interfaces, targeting VMEbus and CompactPCI chassis environments common in SCADA and DCS integration projects of the late 1990s and early 2000s. Mid-generation modules transitioned to Intel Core and Atom processor families, incorporating PCIe Gen 2 backplane connectivity, IPMI 2.0 baseboard management, and ECC DDR3 memory subsystems. Current and late-series ASMC modules support PCIe Gen 3, DDR4 ECC, and extended temperature ranges of -40°C to +85°C for harsh environment deployment. Compatibility across generations is chassis-dependent; PICMG 2.0 R3.0 compliance is maintained across most mid-to-late series units, but early-generation modules require verification against specific backplane pinout revisions. Firmware and BIOS versions are not cross-compatible between generations without factory re-flashing.

ASMC Full Catalog & Functionalities (SKU List)

The following SKUs represent verified models within the Kontron ASMC series, classified by functional category:

Controller / SBC Modules

  • ASMC2177G: CompactPCI SBC, Intel Core i7, dual GbE, PCIe Gen 3, extended temp controller module
  • ASMC2175G: CompactPCI SBC, Intel Core i5, single GbE, PCIe Gen 2, standard temp industrial controller
  • ASMC2173G: CompactPCI SBC, Intel Core i3, entry-level processing, dual serial, industrial controller
  • ASMC2170G: CompactPCI SBC, Intel Atom E3800, low-power embedded controller, fanless design
  • ASMC2160G: CompactPCI SBC, Intel Core 2 Duo, legacy mid-range controller, DDR2 memory

I/O Modules

  • ASMC-DIO32: 32-channel digital I/O module, optically isolated, CompactPCI rear I/O
  • ASMC-AIO16: 16-channel analog I/O, 16-bit resolution, ±10V differential input range
  • ASMC-DI16: 16-channel digital input module, 24VDC logic, DIN rail compatible rear transition
  • ASMC-DO16: 16-channel digital output module, relay and transistor output options
  • ASMC-AI8: 8-channel analog input, 4–20mA current loop, process signal acquisition

Communication & Network Adapter Modules

  • ASMC-ETH4: Quad-port GbE communication adapter, Intel i350 chipset, VLAN support
  • ASMC-CAN2: Dual-channel CANbus interface module, ISO 11898-2, industrial fieldbus adapter
  • ASMC-RS4: 4-port RS-232/422/485 serial communication module, software-selectable protocol
  • ASMC-PCIE4: PCIe x4 expansion bridge module, CompactPCI to PCIe host adapter

Power Supply Modules

  • ASMC-PSU6U: 6U CompactPCI power supply module, 200W, -48VDC telecom input, hot-swap capable
  • ASMC-PSU3U: 3U CompactPCI power supply, 100W, AC/DC universal input, redundancy-ready

Quality Control for the ASMC Range

ASMC modules present specific test challenges due to their CompactPCI backplane bus architecture and multi-function I/O subsystems. DriveKNMS applies a structured test protocol to all ASMC units prior to shipment. Each controller module undergoes POST (Power-On Self-Test) verification, BIOS integrity check, and memory subsystem stress testing using industry-standard burn-in tools. Backplane connector integrity is inspected under magnification for pin deformation, oxidation, and solder joint fatigue — common failure modes in modules removed from high-vibration environments. I/O modules are tested under active signal conditions: digital I/O channels are verified for correct logic levels and isolation resistance; analog modules are calibrated against traceable reference standards. Communication modules are validated for link establishment, packet integrity, and protocol compliance using dedicated bus analyzers. All units are powered in a controlled environment for a minimum 24-hour burn-in period before final inspection and packaging.

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