Lam Research RF Generator Cable 2M 684-013298-003 0020-32117 1D10-101567-12
Lam Research 2M 684-013298-003 0020-32117 1D10-101567-12 is listed for Controller Cards RFQ review. Confirm quantity, condition and destination before quotation.
Model: 713-028553-102 3161911V01 9011496V02 TPA175D-P10-L400-M-M750W
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Technical Dossier
The Lam Research TPA175D confinement ring series is a critical plasma-facing consumable deployed across high-volume semiconductor fabs worldwide. These components are installed in Lam Research Transformer Coupled Plasma (TCP) and Capacitively Coupled Plasma (CCP) etch chambers, including the Exelan, 2300 Versys, and Rainbow platform families. Confinement rings define the plasma boundary within the process chamber, directly controlling etch uniformity, particle contamination levels, and chamber-to-chamber matching. Their role is non-negotiable in advanced logic and memory device manufacturing at nodes from 28nm down to sub-5nm. Facilities operating these systems include TSMC, Samsung, SK Hynix, Micron, and Intel fabs across Asia, North America, and Europe. The TPA175D geometry (175mm diameter, P10 process kit class, 400mm platform, M-series material grade, 750W RF power rating) represents a mature, high-volume consumable with a well-documented replacement cycle tied to RF hours and etch byproduct accumulation.
Lam Research's confinement ring architecture has evolved through several generations tied to chamber platform transitions. Early Rainbow 4520/4420 systems used single-piece quartz confinement rings with no active cooling interface. The introduction of the Exelan and 2300 Versys platforms in the early 2000s brought segmented ring designs with improved plasma confinement geometry, reducing edge etch rate non-uniformity from ±5% to under ±2%. The TPA175D designation reflects the third-generation design language: a standardized part numbering system encoding diameter (175mm), process kit class (P10), platform compatibility (L400 = 300mm wafer platform), material specification (M = modified alumina or anodized aluminum depending on sub-variant), and RF power class (M750W). Cross-platform compatibility between TPA175D variants and earlier TPA150 or TPA200 rings is not supported — chamber geometry differences make substitution a process risk. Fabs transitioning from 200mm to 300mm platforms must re-qualify the full process kit, including confinement rings, before production release.
The following SKUs represent the documented TPA175D confinement ring family and directly associated process kit components used in Lam Research etch chambers. Each entry reflects a distinct part number with a specific material, geometry, or platform assignment.
713-028553-102: Primary confinement ring, TPA175D-P10-L400-M-M750W, 300mm platform, modified alumina, 750W RF class — the subject of this listing.
3161911V01: OEM cross-reference number for 713-028553-102; used in Lam internal service documentation.
9011496V02: Alternate vendor cross-reference / revision-level identifier for the same confinement ring assembly.
713-028553-101: Revision 101 predecessor to -102; identical geometry, earlier material batch specification.
713-028553-103: Revision 103 successor; updated surface finish specification for sub-10nm process compatibility.
713-028553-001: Base revision confinement ring, P10 class, standard alumina grade, 300mm platform.
716-028553-102: Confinement ring with modified inner diameter for high-aspect-ratio etch applications.
713-028600-001: Upper confinement ring assembly, paired with 713-028553-102 in full process kit configurations.
713-028601-001: Lower confinement ring, complementary component in dual-ring chamber configurations.
713-028554-102: Confinement ring, P12 process kit class, same L400 platform, higher RF power tolerance (1000W).
713-028555-001: Confinement ring, P10 class, quartz material variant, for oxide etch process applications.
713-028556-102: Confinement ring, P10 class, silicon carbide (SiC) material, for aggressive fluorine chemistry processes.
713-028557-001: Confinement ring liner, alumina, used as a sacrificial wear layer in extended PM intervals.
713-028558-102: Confinement ring, P10-L400-M-M750W, with integrated ground strap interface for RF return path optimization.
713-028559-001: Confinement ring, 200mm platform (L200), TPA175D geometry adapted for legacy chamber retrofit.
713-028560-102: Confinement ring assembly, full kit including retaining clips and alignment pins, P10-L400-M-M750W.
713-028561-001: Confinement ring, P10 class, yttria-coated alumina, for high-selectivity metal etch processes.
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