Lam Research RF Generator Cable 2M 684-013298-003 0020-32117 1D10-101567-12
Lam Research 2M 684-013298-003 0020-32117 1D10-101567-12 is listed for Controller Cards RFQ review. Confirm quantity, condition and destination before quotation.
Model: 810-800256-207 810-802902-026 810-028295-173 853-049542-173 0190-13298
Product Overview
Commercial availability is handled through direct RFQ, model verification and export-oriented follow-up rather than public cart checkout.
Datasheet Preview
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Commercial Path
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Technical Dossier
RFQ support for obsolete parts: Send the model number, required quantity and destination so DriveKNMS can confirm sourcing options before quotation.
| Primary Part Number | 810-800256-207 |
| Cross-Reference / Alternate P/N | 810-802902-026 / 810-028295-173 / 853-049542-173 / 0190-13298 |
| Revision | Rev B |
| Component Type | Node Board (PCB Assembly) |
| OEM | Lam Research Corporation |
| Compatible Platform | Lam Research TCP (Transformer Coupled Plasma) Etch Systems; Lam Research Dielectric Etch Chambers |
| Obsolescence Status | Discontinued – No longer manufactured or supported by OEM |
| Country of Origin | United States |
| Condition Available | New Surplus / Tested Refurbished (specified at time of order) |
Note: Electrical parameters specific to this board are not published in open documentation. DriveKNMS does not fabricate specifications. Confirmed parameters are provided upon request with test records.
Lam Research TCP etch platforms were deployed extensively throughout the 200mm and early 300mm era. Many of these chambers remain in active production at mature-node fabs, MEMS manufacturers, compound semiconductor facilities, and research institutions — environments where the process recipe, chamber history, and qualification data represent years of engineering investment that cannot be transferred to a new tool without significant cost and risk.
The Node Board in this architecture manages communication and control functions within the chamber's distributed control network. Its failure does not degrade performance gradually — it typically results in a hard fault that takes the chamber offline immediately. Because Lam Research ceased production of this board and has not offered a supported replacement path, procurement teams face a binary choice: locate a verified spare from the secondary market, or begin the capital justification process for a chamber replacement.
For discontinued PCB assemblies, condition verification is not a formality — it is a safety requirement. Every 810-800256-207 board processed by DriveKNMS passes a structured 5-stage inspection protocol before it is offered for sale:
Stage 1 – Visual and Physical Inspection: Full board examination for mechanical damage, burn marks, delamination, and connector integrity. Boards with any structural compromise are rejected at this stage.
Stage 2 – Electrolytic Capacitor Assessment: Aged electrolytic capacitors are the primary failure mode in boards of this generation. Each capacitor is individually checked for ESR deviation, bulging, and electrolyte leakage. Out-of-tolerance capacitors are replaced with equivalent-rated components before the board proceeds.
Stage 3 – Pin and Connector Corrosion Audit: All edge connectors, backplane pins, and inter-board connectors are inspected under magnification for oxidation, fretting corrosion, and contact deformation. Affected contacts are cleaned or the board is flagged for disclosure.
Stage 4 – Firmware Version Verification: Where firmware is embedded, the revision is documented and cross-checked against known compatible versions for the target platform. Version mismatches are disclosed prior to shipment.
Boards that do not pass all five stages are either remediated to standard or sold as-is with full condition disclosure — never represented as tested-good.
The 810-800256-207 is a direct drop-in replacement for the original board position in compatible Lam Research TCP and Dielectric Etch chambers. No hardware modification to the chassis is required. The board interfaces with the existing backplane and chamber control architecture using the original connector and communication protocol — there is no requirement for software reconfiguration, recipe modification, or process requalification triggered solely by the board swap.
This matters operationally: a maintenance team can execute the replacement during a scheduled PM window without involving process engineering or triggering a requalification run. The avoided engineering cost alone — typically 40–80 hours of process engineer time plus wafer qualification costs — represents a return that dwarfs the cost of the spare part itself. Facilities that have replaced this board report chamber return-to-production times measured in hours, not weeks.
Q: Can you source other Lam Research discontinued boards?
A: Yes. DriveKNMS maintains an active sourcing network for Lam Research legacy components across TCP, DRAM, and oxide etch platforms. Submit your part number for a sourcing assessment.
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