Lam Research TYPE 24 Node Board 855-057480-003 / 810-056663-007 / 45901171 / 945Y2NO/NCFSMFFA / LF-40M-A-EVD1

Technical Dossier

Product Details And Specifications

Lam Research TYPE 24 Series Technical Notes

The Lam Research TYPE 24 Node Board is a critical control and communication module deployed within Lam Research etch and deposition platforms — systems that form the backbone of semiconductor fabrication lines in high-volume manufacturing environments including logic fabs, memory fabs, and advanced packaging facilities. Part numbers 855-057480-003, 810-056663-007, 45901171, and the assembly designation 945Y2NO/NCFSMFFA LF-40M-A-EVD1 all refer to revision-specific or sub-assembly variants of this node board architecture. These boards are embedded within the equipment controller hierarchy of Lam Research systems such as the Versys, Exelan, 2300, and TCP platforms, where they manage distributed I/O, inter-node communication, and real-time process data routing. Installed base of TYPE 24 architecture spans fabs across the United States, Taiwan, South Korea, Japan, and China, making long-term spare parts availability a critical operational concern for process engineers and equipment managers.

TYPE 24 Full Catalog & Functionalities (SKU List)

The following part numbers are associated with the Lam Research TYPE 24 node board ecosystem and related control board assemblies used across Lam Research etch and CVD platforms. Each entry reflects a distinct revision, sub-assembly, or functionally equivalent variant:

• 855-057480-003: TYPE 24 Node Board, Rev 003 — primary control node for distributed I/O management on Lam etch platforms.
• 810-056663-007: Node Board sub-assembly, Rev 007 — lower-level PCB assembly integrated into the 855-057480-003 top-level assembly.
• 45901171: Lam Research internal reference number — cross-references to the TYPE 24 node board assembly for procurement and MRO tracking.
• 945Y2NO/NCFSMFFA: Board configuration/firmware designation — identifies the functional software load and hardware configuration variant of the LF-40M-A-EVD1 assembly.
• LF-40M-A-EVD1: Assembly-level designation for the TYPE 24 node board in the EVD1 configuration — used in specific Lam Research platform generations.
• 855-057480-001: TYPE 24 Node Board, Rev 001 — earlier revision; functionally similar but with different component population and firmware baseline.
• 855-057480-002: TYPE 24 Node Board, Rev 002 — intermediate revision with updated signal conditioning circuitry.
• 810-056663-001: Node Board PCB sub-assembly, Rev 001 — base PCB layer for early TYPE 24 builds.
• 810-056663-005: Node Board PCB sub-assembly, Rev 005 — mid-life revision with updated trace routing for EMI compliance.
• 853-049200-001: Related Lam Research I/O interface board — communicates with TYPE 24 node over backplane bus in multi-node configurations.
• 853-049200-003: I/O interface board, Rev 003 — updated revision with expanded channel count for high-density I/O configurations.
• 810-048100-002: Backplane communication board — provides the physical and electrical interface layer between TYPE 24 nodes and the system controller.
• 855-034500-001: System controller interface board — upper-level board that aggregates data from multiple TYPE 24 nodes.
• 810-034500-003: Controller interface PCB sub-assembly, Rev 003 — updated layout for improved signal integrity at higher bus speeds.
• 853-057000-001: Power distribution board for TYPE 24 node cluster — provides regulated DC rails to node boards in multi-slot chassis configurations.
• 810-057000-002: Power board PCB sub-assembly, Rev 002 — updated power stage with improved thermal management for high-duty-cycle operation.
• 855-060100-001: Communication adapter board — bridges TYPE 24 node bus to external host interface for diagnostic and process data logging.