SIEMENS 6ES7193-6BP20-0BB0 Terminal Module – ET 200SP
Siemens 6ES7193-6BP20-0BB0 is listed for ET 200SP RFQ review. Confirm quantity, condition and destination before quotation.
Model: 6ES7135-6FB00-0BA1
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Technical Dossier
The Siemens ET 200SP is a modular distributed I/O system designed for integration with SIMATIC S7-1500 and S7-1200 controllers via PROFINET or PROFIBUS. It is deployed across global heavy industry sectors including petrochemical refineries, nuclear power auxiliary systems, offshore platforms, and continuous-process chemical plants. Its compact backplane architecture — with modules as narrow as 15 mm — allows high-density I/O configurations in space-constrained control cabinets. The ET 200SP has become a standard reference platform for new DCS and PLC installations in Europe, Asia-Pacific, and the Middle East, with an installed base spanning hundreds of thousands of nodes.
The specific module covered on this page, the 6ES7135-6FB00-0BA1, is a digital output module within the ET 200SP family, rated for 4-channel high-feature digital output at 24 V DC / 2 A per channel. It is used in safety-adjacent applications requiring per-channel diagnostics and short-circuit protection.
The ET 200SP was introduced by Siemens in 2013 as the successor to the ET 200S platform, addressing limitations in module density, wiring complexity, and PROFINET integration. The original ET 200S (6ES7131/132/138 series) required separate terminal modules and had a larger physical footprint. The ET 200SP consolidated the terminal block into a BaseUnit concept, where each I/O module snaps onto a pre-wired BaseUnit (BU type A0, B0, etc.), eliminating the need to re-wire during module replacement.
Key architectural milestones: the initial release (2013) supported PROFINET IO with up to 64 modules per station; the 2016 revision introduced fail-safe (F) modules for SIL 2/3 applications under IEC 61508; the 2018–2020 period saw the addition of technology modules (TM) for counting, positioning, and IO-Link master functions; post-2021 variants added OPC UA server capability directly at the interface module level. Backward compatibility is maintained at the BaseUnit level — a replacement module of the same type installs without rewiring, but firmware compatibility between interface modules (IM 155-6) and I/O modules must be verified via the SIMATIC compatibility tool.
Digital Input Modules (DI)
Digital Output Modules (DQ / DO)
Analog Input Modules (AI)
Analog Output Modules (AQ)
Interface Modules (IM)
Technology & Communication Modules (TM / CM)
While the ET 200SP platform remains in active production as of 2026, specific early-revision modules — including the 6ES7135-6FB00-0BA1 (revision BA1) — have been superseded by updated hardware revisions in some sub-series. Plants operating on original 2013–2016 firmware baselines may require exact hardware revision matches to avoid compatibility conflicts with existing IM 155-6 firmware versions.
ET 200SP modules present specific test challenges due to their integrated BaseUnit interface, backplane bus communication protocol (PROFINET/PROFIBUS at the module level), and per-channel diagnostic registers. DriveKNMS applies the following test protocol to all ET 200SP units prior to dispatch:
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