Tokyo Electron 2986 Series Modules | TEL 2986-411806-11
Tokyo Electron (TEL) 2986 Series: Comprehensive Module Range and Technical Overview The Tokyo Electron (TEL) 2986 Series represents a core…
Model: TTLA07-13 F-MFC_16, 3880-200121-14 3895-120916-14 WCSH-0240-0000 0195-00218 773100
Product Overview
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Datasheet Preview
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Commercial Path
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Technical Dossier
The Tokyo Electron (TEL) TTLA07 series, encompassing the F-MFC_16 mass flow controller PCB platform, is a critical subsystem deployed across semiconductor fabrication equipment globally. TEL systems are installed in high-volume fabs operating CVD, ALD, etch, and diffusion processes at leading foundries and IDMs across Japan, South Korea, Taiwan, the United States, and Europe. The TTLA07-13 F-MFC_16 PCB assembly — cross-referenced under part numbers 3880-200121-14, 3895-120916-14, WCSH-0240-0000, 0195-00218, and 773100 — serves as the primary interface and control board for multi-channel mass flow control within TEL process chambers. Its role in maintaining gas delivery precision makes it a high-criticality spare part for any fab running TEL Trias, Telius, or Tactras platforms.
The TTLA07 PCB platform was developed as part of TEL's modular gas box and MFC control architecture, introduced to standardize multi-channel flow control across its 200mm and 300mm process tool generations. Early revisions of the F-MFC_16 board (suffix -11, -12) used through-hole components for analog signal conditioning and were designed for compatibility with TEL's proprietary RS-485-based MFC communication protocol. Subsequent revisions (-13, -14) transitioned to surface-mount technology, improving noise immunity and enabling higher-density channel integration.
The -14 revision (3895-120916-14) introduced enhanced ESD protection circuitry and revised firmware ROM addressing, making it partially backward-compatible with -13 installations subject to firmware validation. The WCSH-0240-0000 sub-assembly represents the wiring harness and connector interface layer that mates with the TTLA07-13 PCB, and must be sourced as a matched set in many TEL tool configurations. As TEL has transitioned newer platforms to digital MFC protocols (e.g., DeviceNet, EtherCAT), the TTLA07 / F-MFC_16 series has entered its mature/end-of-life phase, with no new production runs confirmed. Fabs maintaining legacy TEL tools must rely on aftermarket and refurbished inventory for ongoing support.
The following SKUs represent the verified component ecosystem of the TEL TTLA07 / F-MFC_16 platform. Each entry reflects a distinct functional role within the gas delivery and MFC control subsystem:
TTLA07-13: F-MFC_16 main PCB assembly, 16-channel MFC control interface board
3880-200121-14: PCB revision -14 sub-assembly, analog signal conditioning layer for MFC channels 1–8
3895-120916-14: PCB revision -14 sub-assembly, analog signal conditioning layer for MFC channels 9–16
WCSH-0240-0000: Wiring harness assembly, 240-pin connector interface for TTLA07 backplane integration
0195-00218: Firmware ROM module, factory-programmed for TTLA07-13 F-MFC_16 platform
773100: PCB identification / traceability label assembly, TEL internal part reference
TTLA07-11: F-MFC_16 early-revision PCB, through-hole design, 200mm tool generation
TTLA07-12: F-MFC_16 intermediate-revision PCB, mixed SMT/through-hole, transitional generation
TTLA07-14: F-MFC_16 latest-revision PCB, full SMT, enhanced ESD protection
3880-200121-11: Analog sub-board revision -11, channels 1–8, early generation
3880-200121-12: Analog sub-board revision -12, channels 1–8, intermediate generation
3895-120916-11: Analog sub-board revision -11, channels 9–16, early generation
3895-120916-12: Analog sub-board revision -12, channels 9–16, intermediate generation
WCSH-0240-0001: Wiring harness assembly, revised connector locking mechanism, updated revision
0195-00219: Firmware ROM module, updated revision for TTLA07-14 compatibility
TTLA07-13-R: Factory-refurbished TTLA07-13 PCB, TEL-certified remanufacture designation
3880-200121-14-R: Refurbished analog sub-board, channels 1–8, tested to OEM specification
DriveKNMS maintains a dedicated inventory program for end-of-life and hard-to-find TEL TTLA07 / F-MFC_16 components. As Tokyo Electron has discontinued active production of this PCB series, fabs operating legacy Trias, Telius, and Tactras tools face increasing lead times and supply constraints through standard OEM channels. DriveKNMS sources TTLA07-13, 3880-200121-14, 3895-120916-14, WCSH-0240-0000, 0195-00218, and 773100 units through a global network of decommissioned fab equipment, certified refurbishers, and authorized surplus dealers. All units are catalogued with full traceability documentation including date codes, revision markings, and source fab records where available. For fabs requiring long-term maintenance agreements (LTMAs) or buffer stock programs for TTLA07 series components, DriveKNMS offers consignment and reserved inventory arrangements with guaranteed response SLAs.
Each TTLA07 / F-MFC_16 PCB processed by DriveKNMS undergoes a structured multi-stage inspection protocol designed for the specific electrical and mechanical characteristics of this platform. Visual inspection covers solder joint integrity on all SMT and through-hole components, connector pin condition on the 240-pin WCSH interface, and ROM module seating. Functional testing is performed using a dedicated TEL-compatible MFC signal simulator that replicates the RS-485 communication protocol and analog setpoint/readback signal chain for all 16 channels simultaneously. Boards are powered at nominal TEL bus voltage (typically +15V / -15V / +5V) and channel-by-channel calibration verification is performed against OEM reference tolerances. Firmware ROM modules (0195-00218 / 0195-00219) are verified for correct checksum and boot sequence prior to shipment. All tested units are issued a DriveKNMS inspection certificate with test date, technician ID, and pass/fail data for each channel.