Toshiba B200 Series Modules B200P16DOP-1 DC Output Module

Technical Dossier

Product Details And Specifications

Toshiba B200 Series Technical Notes

The Evolution of B200 Architecture

The B200 platform was introduced as part of Toshiba's programmable controller expansion into mid-scale industrial automation, succeeding earlier T-series rack systems. The architecture is built around a parallel backplane bus with fixed slot addressing, supporting a base rack and expansion racks connected via dedicated I/O bus cables. CPU modules communicate with I/O modules through a synchronous scan protocol, with typical scan times in the 1–10 ms range depending on program size and I/O count.

Early B200 configurations used discrete transistor-output and relay-output modules with 8- or 16-point density. Later revisions introduced higher-density 32-point modules and analog I/O cards with 12-bit and 14-bit resolution. Communication options expanded over the product lifecycle to include RS-232C, RS-485, and proprietary Toshiba network adapters for integration with SCADA and DCS supervisory layers.

Compatibility constraints are a known engineering consideration: B200 CPU firmware versions are tied to specific module hardware revisions. Substituting a module from a different production batch without verifying firmware compatibility can result in initialization faults or degraded I/O response. DriveKNMS maintains hardware revision records for all stocked B200 modules to support compatibility-verified replacements.

B200 Full Catalog & Functionalities (SKU List)

CPU & Controller Modules

• B200CPU1: Base CPU module, 2K step program memory, standard scan
• B200CPU2: Enhanced CPU, 4K step memory, extended instruction set
• B200CPU3: High-speed CPU, 8K step, floating-point arithmetic support

DC Output Modules

• B200P16DOP-1: 16-point 24VDC transistor sink output module, 0.5A per point
• B200P32DOP-1: 32-point 24VDC transistor sink output, high-density rack format
• B200P16DOP-2: 16-point 24VDC source output variant, NPN/PNP selectable

DC Input Modules

• B200P16DIP-1: 16-point 24VDC sink input module, 7mA input current
• B200P32DIP-1: 32-point 24VDC input, high-density, common terminal grouping
• B200P16DIP-2: 16-point 12/24VDC dual-voltage input module

AC Output Modules

• B200P08AOP-1: 8-point 100–240VAC triac output, 1A per point
• B200P16AOP-1: 16-point 100–240VAC triac output module

AC Input Modules

• B200P08AIP-1: 8-point 100–240VAC input, optically isolated
• B200P16AIP-1: 16-point 100–240VAC input module

Analog I/O Modules

• B200P04AIM-1: 4-channel analog input, 4–20mA / 0–10V, 12-bit resolution
• B200P02AOM-1: 2-channel analog output, 4–20mA, 12-bit DAC
• B200P04AOM-1: 4-channel analog output, voltage/current selectable

Communication & Power Modules

• B200P-COM1: RS-232C/RS-485 communication adapter module
• B200P-PSU1: 24VDC rack power supply module, 5A rated output

Sourcing Hard-to-Find & Obsolete B200 Series Parts

Cross-reference support is available for customers evaluating migration from B200 to current Toshiba or third-party PLC platforms, including I/O point mapping, rack layout analysis, and program conversion feasibility assessment.

Quality Control for the B200 Range

B200 modules use a parallel backplane bus architecture with edge-connector termination. Quality control procedures at DriveKNMS address the specific failure modes associated with this design: backplane connector pin wear, output driver transistor degradation, optocoupler aging in input circuits, and EEPROM data retention in CPU modules.