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Model: SI 716-230577-384 SI 716-230577-941 0020-22585
Product Overview
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Datasheet Preview
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Commercial Path
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Technical Dossier
The Lam Research SI 716 platform is a process chamber architecture deployed across high-volume semiconductor fabrication facilities globally, including 200mm and 300mm wafer fabs engaged in plasma etch, CVD, and surface treatment processes. SI 716 chamber components — including ring assemblies, focus rings, confinement rings, and liner kits — are critical consumable and semi-permanent parts that directly govern plasma uniformity, etch selectivity, and chamber-to-chamber matching. These parts are installed in facilities operated by leading IDMs and foundries across the United States, Japan, South Korea, Taiwan, and Europe. The SI 716 series maintains a significant installed base in mature nodes (90nm–350nm) where long-term production continuity depends on reliable spare parts sourcing.
The SI 716 chamber design traces its lineage to Lam Research's Rainbow and TCP (Transformer Coupled Plasma) etch platforms introduced in the early 1990s. The SI 716 designation encompasses a family of chamber hardware revisions that evolved through multiple generations of process node requirements. Early SI 716 configurations used alumina-based ceramic rings with relatively wide process windows suited to 0.35µm–0.25µm geometries. As device scaling progressed into the 130nm–90nm range, Lam introduced revised ring geometries and yttria-coated (Y₂O₃) components to improve plasma resistance and extend mean time between cleans (MTBC). The SI 716-230577 sub-series — which includes the SI 716-230577-384 and SI 716-230577-941 variants — represents a specific revision level of the ring assembly, differentiated by dimensional tolerances, material grade, or compatibility with specific chamber body revisions. Cross-reference part 0020-22585 is the Lam internal catalog number used in BOM documentation and service manuals. Compatibility between SI 716-230577-384 and SI 716-230577-941 must be verified against the specific chamber serial number and process kit revision before installation.
The following SKUs represent verified components within the Lam Research SI 716 and associated chamber hardware ecosystem. Parts are categorized by function:
Ring Assemblies & Process Kit Components
The SI 716 platform is in the mature-to-end-of-life phase of its product lifecycle. Lam Research has progressively discontinued factory support for SI 716 chamber hardware as fabs migrate to Flex, Kiyo, and Syndion platform architectures. This creates a structural supply gap for fabs that continue to operate SI 716-equipped tools on extended depreciation schedules or for legacy product lines that cannot justify a tool upgrade. DriveKNMS maintains a dedicated inventory program for SI 716 consumables and semi-permanent parts, including ring assemblies in the 0020-22585 / SI 716-230577 family. Sourcing channels include decommissioned tool teardowns, authorized distributor excess stock, and cross-qualified OEM-equivalent parts manufactured to Lam Research dimensional specifications. All parts are supplied with full traceability documentation including lot records, material certifications, and dimensional inspection reports where applicable. For fabs requiring long-term supply agreements (LTSAs) covering SI 716 process kits, DriveKNMS offers blanket order programs with guaranteed lead times.
SI 716 ring assemblies and chamber components require specialized inspection protocols due to the precision tolerances governing plasma confinement geometry. DriveKNMS applies the following quality control procedures to all SI 716 parts prior to shipment: dimensional verification using calibrated CMM (Coordinate Measuring Machine) equipment against Lam Research engineering drawing tolerances; surface finish inspection (Ra measurement) for plasma-facing surfaces to confirm coating integrity on yttria or alumina-coated components; visual inspection under UV and white light for micro-cracks, delamination, or contamination on ceramic and quartz parts; helium leak testing for O-ring groove geometry on vacuum-sealing components; and ESD-safe packaging with nitrogen purge for electrostatic-sensitive components including ESC cover rings and RF-path parts. Parts that do not meet dimensional or surface specifications are quarantined and not released to inventory.