Lam Research TPA175D Confinement Ring: 713-028553-102 / 3161911V01 / 9011496V02 / TPA175D-P10-L400-M-M750W —

Technical Dossier

Product Details And Specifications

Lam Research TPA175D Series: Comprehensive Confinement Ring Range and Technical Overview

The Lam Research TPA175D confinement ring series is a critical plasma-facing consumable deployed across high-volume semiconductor fabs worldwide. These components are installed in Lam Research Transformer Coupled Plasma (TCP) and Capacitively Coupled Plasma (CCP) etch chambers, including the Exelan, 2300 Versys, and Rainbow platform families. Confinement rings define the plasma boundary within the process chamber, directly controlling etch uniformity, particle contamination levels, and chamber-to-chamber matching. Their role is non-negotiable in advanced logic and memory device manufacturing at nodes from 28nm down to sub-5nm. Facilities operating these systems include TSMC, Samsung, SK Hynix, Micron, and Intel fabs across Asia, North America, and Europe. The TPA175D geometry (175mm diameter, P10 process kit class, 400mm platform, M-series material grade, 750W RF power rating) represents a mature, high-volume consumable with a well-documented replacement cycle tied to RF hours and etch byproduct accumulation.

The Evolution of TPA175D Architecture

Lam Research's confinement ring architecture has evolved through several generations tied to chamber platform transitions. Early Rainbow 4520/4420 systems used single-piece quartz confinement rings with no active cooling interface. The introduction of the Exelan and 2300 Versys platforms in the early 2000s brought segmented ring designs with improved plasma confinement geometry, reducing edge etch rate non-uniformity from ±5% to under ±2%. The TPA175D designation reflects the third-generation design language: a standardized part numbering system encoding diameter (175mm), process kit class (P10), platform compatibility (L400 = 300mm wafer platform), material specification (M = modified alumina or anodized aluminum depending on sub-variant), and RF power class (M750W). Cross-platform compatibility between TPA175D variants and earlier TPA150 or TPA200 rings is not supported — chamber geometry differences make substitution a process risk. Fabs transitioning from 200mm to 300mm platforms must re-qualify the full process kit, including confinement rings, before production release.

TPA175D Full Catalog & Functionalities (SKU List)

The following SKUs represent the documented TPA175D confinement ring family and directly associated process kit components used in Lam Research etch chambers. Each entry reflects a distinct part number with a specific material, geometry, or platform assignment.

713-028553-102: Primary confinement ring, TPA175D-P10-L400-M-M750W, 300mm platform, modified alumina, 750W RF class — the subject of this listing.
3161911V01: OEM cross-reference number for 713-028553-102; used in Lam internal service documentation.
9011496V02: Alternate vendor cross-reference / revision-level identifier for the same confinement ring assembly.
713-028553-101: Revision 101 predecessor to -102; identical geometry, earlier material batch specification.
713-028553-103: Revision 103 successor; updated surface finish specification for sub-10nm process compatibility.
713-028553-001: Base revision confinement ring, P10 class, standard alumina grade, 300mm platform.
716-028553-102: Confinement ring with modified inner diameter for high-aspect-ratio etch applications.
713-028600-001: Upper confinement ring assembly, paired with 713-028553-102 in full process kit configurations.
713-028601-001: Lower confinement ring, complementary component in dual-ring chamber configurations.
713-028554-102: Confinement ring, P12 process kit class, same L400 platform, higher RF power tolerance (1000W).
713-028555-001: Confinement ring, P10 class, quartz material variant, for oxide etch process applications.
713-028556-102: Confinement ring, P10 class, silicon carbide (SiC) material, for aggressive fluorine chemistry processes.
713-028557-001: Confinement ring liner, alumina, used as a sacrificial wear layer in extended PM intervals.
713-028558-102: Confinement ring, P10-L400-M-M750W, with integrated ground strap interface for RF return path optimization.
713-028559-001: Confinement ring, 200mm platform (L200), TPA175D geometry adapted for legacy chamber retrofit.
713-028560-102: Confinement ring assembly, full kit including retaining clips and alignment pins, P10-L400-M-M750W.
713-028561-001: Confinement ring, P10 class, yttria-coated alumina, for high-selectivity metal etch processes.

Sourcing Hard-to-Find & Obsolete TPA175D Parts

DriveKNMS maintains a dedicated inventory program for Lam Research confinement rings and process kit consumables, including discontinued revision levels and end-of-life part numbers. The TPA175D series, while still in active production for current-generation chambers, includes several revision levels (Rev 101, Rev 001, early quartz variants) that Lam Research no longer stocks through standard distribution channels. Fabs operating legacy Exelan or early 2300 Versys chambers frequently require these older revisions to maintain chamber-to-chamber matching without full process re-qualification. DriveKNMS sources these components through certified secondary market channels, with full traceability documentation including original manufacturer certificates of conformance where available. Lead times for obsolete revisions are typically 2–8 weeks depending on global inventory position. Emergency same-week dispatch is available for critical fab situations. All parts are stored in ESD-safe, cleanroom-compatible packaging to preserve surface integrity prior to installation.

Quality Control for the TPA175D Range

Confinement rings are plasma-facing components with tight dimensional and surface finish tolerances. DriveKNMS applies a multi-stage inspection protocol to all TPA175D inventory prior to dispatch. Dimensional verification is performed using calibrated CMM (Coordinate Measuring Machine) equipment, checking inner diameter, outer diameter, thickness, and flatness against OEM engineering drawings. Surface finish is inspected under UV light and optical microscopy to detect micro-cracks, delamination, or contamination that would cause particle generation in-chamber. For alumina and yttria-coated variants, coating adhesion is verified using cross-hatch tape test per ASTM D3359. RF-class components (M750W designation) are verified for dielectric integrity using high-voltage insulation resistance testing. Each unit is individually bagged in double-layer cleanroom polyethylene with desiccant, labeled with part number, revision, inspection date, and inspector ID. A full inspection report is available upon request for any shipment.