Lam Research TYPE 24 Node Board: 855-057480-003 / 810-056663-007 / 45901171 / 945Y2NO/NCFSMFFA / LF-40M-A-EVD1 —

Technical Dossier

Product Details And Specifications

Lam Research TYPE 24 Series: Comprehensive Module Range and Technical Overview

The Lam Research TYPE 24 Node Board is a critical control and communication module deployed within Lam Research etch and deposition platforms — systems that form the backbone of semiconductor fabrication lines in high-volume manufacturing environments including logic fabs, memory fabs, and advanced packaging facilities. Part numbers 855-057480-003, 810-056663-007, 45901171, and the assembly designation 945Y2NO/NCFSMFFA LF-40M-A-EVD1 all refer to revision-specific or sub-assembly variants of this node board architecture. These boards are embedded within the equipment controller hierarchy of Lam Research systems such as the Versys, Exelan, 2300, and TCP platforms, where they manage distributed I/O, inter-node communication, and real-time process data routing. Installed base of TYPE 24 architecture spans fabs across the United States, Taiwan, South Korea, Japan, and China, making long-term spare parts availability a critical operational concern for process engineers and equipment managers.

The Evolution of TYPE 24 Architecture

Lam Research's node board architecture evolved through successive generations of its equipment controller platform. Early Lam systems used centralized VME-based control architectures. The TYPE 24 generation represents a distributed node model, where individual boards handle localized process control tasks and communicate over a proprietary backplane bus. This architecture improved fault isolation and reduced single-point-of-failure risk across the system. The TYPE 24 board interfaces with the system's main controller via a defined communication protocol, and its firmware is tightly coupled to the specific software revision of the host platform. Compatibility between TYPE 24 revisions (e.g., -003 vs. earlier dash numbers) and the host system software must be verified before substitution. As Lam Research has transitioned newer platforms to more integrated SoC-based control architectures, the TYPE 24 series has entered a mature/end-of-life phase. OEM new stock is no longer available through standard distribution channels, making third-party sourcing and refurbished inventory the primary supply path for fabs still operating legacy equipment.

TYPE 24 Full Catalog & Functionalities (SKU List)

The following part numbers are associated with the Lam Research TYPE 24 node board ecosystem and related control board assemblies used across Lam Research etch and CVD platforms. Each entry reflects a distinct revision, sub-assembly, or functionally equivalent variant:

• 855-057480-003: TYPE 24 Node Board, Rev 003 — primary control node for distributed I/O management on Lam etch platforms.
• 810-056663-007: Node Board sub-assembly, Rev 007 — lower-level PCB assembly integrated into the 855-057480-003 top-level assembly.
• 45901171: Lam Research internal reference number — cross-references to the TYPE 24 node board assembly for procurement and MRO tracking.
• 945Y2NO/NCFSMFFA: Board configuration/firmware designation — identifies the functional software load and hardware configuration variant of the LF-40M-A-EVD1 assembly.
• LF-40M-A-EVD1: Assembly-level designation for the TYPE 24 node board in the EVD1 configuration — used in specific Lam Research platform generations.
• 855-057480-001: TYPE 24 Node Board, Rev 001 — earlier revision; functionally similar but with different component population and firmware baseline.
• 855-057480-002: TYPE 24 Node Board, Rev 002 — intermediate revision with updated signal conditioning circuitry.
• 810-056663-001: Node Board PCB sub-assembly, Rev 001 — base PCB layer for early TYPE 24 builds.
• 810-056663-005: Node Board PCB sub-assembly, Rev 005 — mid-life revision with updated trace routing for EMI compliance.
• 853-049200-001: Related Lam Research I/O interface board — communicates with TYPE 24 node over backplane bus in multi-node configurations.
• 853-049200-003: I/O interface board, Rev 003 — updated revision with expanded channel count for high-density I/O configurations.
• 810-048100-002: Backplane communication board — provides the physical and electrical interface layer between TYPE 24 nodes and the system controller.
• 855-034500-001: System controller interface board — upper-level board that aggregates data from multiple TYPE 24 nodes.
• 810-034500-003: Controller interface PCB sub-assembly, Rev 003 — updated layout for improved signal integrity at higher bus speeds.
• 853-057000-001: Power distribution board for TYPE 24 node cluster — provides regulated DC rails to node boards in multi-slot chassis configurations.
• 810-057000-002: Power board PCB sub-assembly, Rev 002 — updated power stage with improved thermal management for high-duty-cycle operation.
• 855-060100-001: Communication adapter board — bridges TYPE 24 node bus to external host interface for diagnostic and process data logging.

Sourcing Hard-to-Find & Obsolete TYPE 24 Parts

The TYPE 24 node board series is no longer manufactured by Lam Research and is not available through OEM new-buy channels. Fabs operating legacy Lam Research platforms face a constrained supply environment where unplanned board failures can result in extended tool downtime. DriveKNMS maintains a dedicated inventory of refurbished, tested, and serialized TYPE 24 node boards and related sub-assemblies sourced from decommissioned equipment, controlled teardowns, and long-term storage lots. All units are inspected, functionally tested, and documented with traceability records prior to shipment. DriveKNMS supports global logistics to semiconductor fabs in the US, EU, Taiwan, South Korea, Japan, Singapore, and China, with expedited shipping options available for critical downtime situations. For customers requiring long-term supply agreements or consignment stock arrangements for TYPE 24 boards, DriveKNMS offers structured MRO partnership programs.

Quality Control for the TYPE 24 Range

TYPE 24 node boards present specific test challenges due to their proprietary backplane bus interface and firmware-dependent initialization sequence. DriveKNMS applies a multi-stage quality control process to all TYPE 24 units: (1) Visual inspection for physical damage, corrosion, and component integrity; (2) In-circuit test (ICT) for passive and active component verification; (3) Functional test using Lam Research-compatible backplane test fixtures that simulate the operational bus environment; (4) Firmware version verification and documentation; (5) Burn-in cycle under representative thermal and electrical load conditions; (6) Final inspection and serialization with test report issuance. Units that do not pass all stages are quarantined and not offered for sale. Test reports are available upon request for customers with specific quality documentation requirements.