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Schneider Electric Modicon Premium

Schneider Electric Modicon Premium TSX57 Series Modules

Model: P127CA1W1D3FC0

Brand Schneider Electric
Series Modicon Premium
Model P127CA1W1D3FC0
RFQ-ready model route Obsolete and surplus sourcing Export follow-up by model list

Product Overview

Commercial availability is handled through direct RFQ, model verification and export-oriented follow-up rather than public cart checkout.

Datasheet Preview

Datasheet Preview

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Commercial Path

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Technical Dossier

Product Details And Specifications

Schneider Electric Modicon Premium TSX57 Series: Comprehensive Module Range and Technical Overview

The Schneider Electric Modicon Premium TSX57 series is a mid-to-high range programmable logic controller (PLC) platform deployed extensively across global heavy industry sectors including petrochemical refining, nuclear power generation, offshore oil & gas, water treatment, and automotive manufacturing. Introduced in the early 1990s as a successor to the TSX40 and TSX47 platforms, the TSX57 established itself as the backbone controller in thousands of continuous-process and discrete-manufacturing installations across Europe, Asia-Pacific, and the Americas. Its modular rack architecture, deterministic scan cycle, and broad I/O density made it the reference platform for Schneider Electric's IEC 61131-3 compliant Unity Pro and PL7 Pro programming environments. The series remains operational in a significant proportion of installed base sites, many of which are in long-term maintenance or life-extension programs.

The Evolution of Modicon Premium TSX57 Architecture

The TSX57 architecture evolved through three distinct generations. The first generation (TSX57 10/20/30/40) used the ISA-derived X-Bus backplane and was programmed exclusively via PL7 Pro software. These units supported Uni-Telway, Fipway, and Modbus communication natively. The second generation introduced the TSX57 44/45/55 CPUs with expanded memory addressing, Ethernet TCP/IP integration via TSXETY modules, and compatibility with the Unity Pro v2.x environment. The third generation, represented by the TSX P57 6634M and related high-end CPUs, added redundant CPU capability, extended process memory up to 7168 KB, and full IEC 61131-3 structured text support.

Backward compatibility within the TSX57 family is rack-level: all TSX57 CPUs are compatible with the same TSX RKY rack series and TSX PSY power supply modules. However, I/O modules from the TSX37 Micro series are not cross-compatible. Communication modules (TSXSCP, TSXETY, TSXFPP) are CPU-generation dependent and must be validated against the specific CPU firmware revision. The transition from PL7 Pro to Unity Pro introduced application migration requirements that affect approximately 40% of legacy TSX57 10/20/30 installations.

Modicon Premium TSX57 Full Catalog & Functionalities (SKU List)

CPU Modules

  • TSX P57 103M: Entry-level CPU, 12 KB program memory, X-Bus rack, PL7 Pro only
  • TSX P57 203M: Standard CPU, 24 KB program memory, Uni-Telway master port integrated
  • TSX P57 253M: Mid-range CPU, 48 KB program memory, dual serial port, Fipway compatible
  • TSX P57 303M: High-capacity CPU, 96 KB program memory, Unity Pro compatible
  • TSX P57 353M: Extended CPU, 160 KB program memory, integrated Ethernet 10BASE-T
  • TSX P57 453M: Advanced CPU, 512 KB program memory, dual Ethernet, redundancy-ready
  • TSX P57 554M: High-end CPU, 1024 KB program memory, hot-standby support
  • TSX P57 6634M: Top-tier CPU, 7168 KB process memory, full Unity Pro v13+ support
  • P127CA1W1D3FC0: Modicon Premium CPU module, factory-configured variant with integrated communication and extended I/O addressing — current listing SKU

Discrete Input Modules (DI)

  • TSX DEY 16D2: 16-channel 24 VDC sink/source discrete input module
  • TSX DEY 32D2K: 32-channel 24 VDC discrete input, HE10 connector, high-density format
  • TSX DEY 64D2K: 64-channel 24 VDC discrete input, dual HE10, rack-mount

Discrete Output Modules (DO)

  • TSX DSY 16T2: 16-channel 24 VDC transistor output, 0.5 A per channel
  • TSX DSY 32T2K: 32-channel 24 VDC transistor output, HE10 connector
  • TSX DSY 08R5: 8-channel relay output, 5 A per channel, 250 VAC rated

Analog I/O Modules (AI/AO)

  • TSX AEY 414: 4-channel analog input, 4–20 mA / 0–10 V, 12-bit resolution
  • TSX AEY 800: 8-channel analog input, thermocouple/RTD compatible, 16-bit resolution
  • TSX ASY 410: 4-channel analog output, 4–20 mA / 0–10 V, 12-bit resolution

Communication & Network Modules

  • TSX ETY 110: Ethernet TCP/IP module, 10BASE-T, Modbus TCP server/client
  • TSX ETY 5103: Ethernet TCP/IP module, 10/100BASE-TX, I/O scanning, Global Data
  • TSX SCP 114: Serial communication module, RS-232/RS-485, Modbus RTU/ASCII master
  • TSX FPP 20: Fipway network module, peer-to-peer messaging, 1 Mbit/s
  • TSX PBY 100: PROFIBUS-DP master module, up to 125 slaves, 12 Mbit/s

Power Supply Modules

  • TSX PSY 2600M: 100–240 VAC input, 26 W output, standard rack power supply
  • TSX PSY 5500M: 100–240 VAC input, 55 W output, high-capacity rack power supply
  • TSX PSY 8500M: 24 VDC input, 85 W output, DC-powered rack supply

Sourcing Hard-to-Find & Obsolete Modicon Premium TSX57 Parts

Schneider Electric officially announced the end-of-commercialization (EOC) phase for the Modicon Premium TSX57 series, with repair and spare parts support transitioning to third-party lifecycle extension providers. DriveKNMS maintains a dedicated inventory of TSX57 CPU modules, I/O cards, communication adapters, and power supplies sourced from decommissioned plant assets, authorized distributor overstock, and factory-refurbished channels.

Quality Control for the Modicon Premium TSX57 Range

TSX57 modules undergo a structured multi-stage inspection protocol at DriveKNMS facilities. Each CPU module is bench-tested under live rack conditions using a TSX RKY 12EX rack with a verified TSX PSY 2600M power supply. Program memory read/write cycles are validated, and the integrated serial and Ethernet ports are tested for full protocol compliance (Modbus RTU, Modbus TCP, Uni-Telway). Backplane X-Bus communication integrity is verified using a logic analyzer to confirm deterministic data transfer between CPU and I/O slots.

For I/O modules, each channel is individually stimulated and measured against factory-specified tolerance bands: ±0.1% for analog modules and <1 ms response time for discrete modules. Communication modules (TSXETY, TSXSCP, TSXFPP) are tested for network frame integrity under simulated load conditions. All modules are inspected for capacitor aging, EEPROM data retention, and connector pin integrity before dispatch. Refurbished units are clearly labeled with inspection date, technician ID, and test report reference.

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