Allen-Bradley 1336 PLUS Series Modules – 1336F-MCB-SP2L 164989 Control Board

Technical Dossier

Product Details And Specifications

Allen-Bradley 1336 PLUS Series Technical Notes

The Allen-Bradley 1336 PLUS series (catalog prefix: 1336F) is a family of AC variable-frequency drives manufactured by Rockwell Automation. Deployed across heavy industrial sectors including petrochemical refineries, nuclear power auxiliary systems, offshore platforms, and continuous-process chemical plants, the 1336 PLUS platform covers output ratings from 0.37 kW (0.5 HP) to 448 kW (600 HP) at 200–600 VAC. Its modular architecture separates the main control board, power structure, and option card slots, enabling field-level component replacement without full drive swap-out. This design has made the 1336 PLUS a long-term fixture in facilities where capital equipment replacement cycles span 20–30 years.

The Evolution of 1336 PLUS Architecture

The 1336 PLUS line succeeded the original 1336 IMPACT and 1336 FORCE drives in Rockwell's AC drive portfolio during the early 1990s. The 1336F designation introduced a unified control board platform (MCB — Main Control Board) that standardized firmware communication across the drive's power modules, I/O expansion slots, and HIM (Human Interface Module) port. The SP2L suffix on the MCB identifies the specific board revision and power rating compatibility bracket.

Subsequent generations introduced the 1336 PLUS II (catalog prefix: 1336E), which retained backward-compatible option card slots (A, B, C) but migrated to a 32-bit DSP control architecture. The 1336 PLUS II added enhanced SCANport communication, enabling direct integration with DeviceNet, ControlNet, and Remote I/O adapters via plug-in option cards. Both the 1336F and 1336E series have been classified by Rockwell Automation as mature/end-of-life products; active manufacturing has ceased, and support is maintained through authorized spare parts channels and third-party MRO suppliers.

Key architectural milestones:

• 1336F (1336 PLUS): Original platform; analog and digital I/O on MCB; SCANport v1 communication; EEPROM-based parameter storage.
• 1336E (1336 PLUS II): 32-bit DSP; expanded SCANport; enhanced fault diagnostics; compatible option card form factor.
• PowerFlex 700 / 755: Current-generation replacement platform; not pin-compatible but functionally equivalent for most applications.

1336 PLUS Full Catalog & Functionalities (SKU List)

The following SKUs represent verified components within the Allen-Bradley 1336 PLUS (1336F) and 1336 PLUS II (1336E) ecosystems. Each entry reflects a discrete, field-replaceable module with a defined functional role within the drive system.

Main Control Boards (MCB)

• 1336F-MCB-SP2L 164989: Main control board, SP2L revision, low-power frame compatibility, analog/digital I/O interface.
• 1336F-MCB-SP1: Main control board, SP1 revision, standard frame, base firmware for 1336 PLUS drives.
• 1336F-MCB-SP2: Main control board, SP2 revision, enhanced fault logging, updated EEPROM map.
• 1336E-MCB-SP1: Main control board for 1336 PLUS II, 32-bit DSP, SCANport v2 host.

Human Interface Modules (HIM)

• 1336-GM1: Full-numeric HIM, 4-line LCD display, parameter programming and fault history access.
• 1336-GM2: Enhanced HIM with upload/download capability for parameter sets.
• 1336-GM6: Remote-mount HIM kit, panel-mount bezel, 1m cable included.

Communication Option Cards (SCANport)

• 1336F-BRF-SP1: Remote I/O (RIO) communication adapter, option slot B/C, 57.6 kbps max.
• 1336F-BDN-SP1: DeviceNet adapter card, option slot B/C, Group 2 slave device.
• 1336F-BCN-SP1: ControlNet adapter, option slot B/C, scheduled and unscheduled messaging.
• 1336F-BEP-SP1: EtherNet/IP adapter, option slot B/C, explicit messaging support.

I/O Expansion Option Cards

• 1336F-B100-AA-EN: Analog I/O expansion card, 2 additional analog inputs (0–10V / 4–20mA), option slot A.
• 1336F-B200-AA-EN: Digital I/O expansion, 6 additional digital inputs, 3 relay outputs, option slot A.
• 1336F-B300-AA-EN: Encoder feedback card, incremental encoder input, closed-loop speed regulation.

Power Supply & Gate Driver Boards

• 1336F-PSA-SP1: Internal 24VDC power supply board, control circuit power, frame B–D compatibility.
• 1336F-GDB-SP1: Gate driver board, IGBT firing control, frame C power structure.
• 1336F-GDB-SP2: Gate driver board, revised IGBT timing, frame D–E power structure.

Dynamic Braking & Precharge

• 1336F-BRK-SP1: Dynamic braking chopper module, internal resistor interface, frame B–C.
• 1336F-PCB-SP1: Precharge board assembly, inrush current limiting, DC bus precharge sequencing.

Sourcing Hard-to-Find & Obsolete 1336 PLUS Parts

For facilities operating 1336 PLUS drives in critical process loops — where a drive failure triggers a plant shutdown event — DriveKNMS provides emergency urgent RFQ handling for items reviewed through RFQ and a global sourcing service for items requiring procurement from secondary markets. Lifecycle extension support includes firmware version matching to ensure MCB replacements are compatible with existing parameter sets stored in the drive's EEPROM.

Quality Control for the 1336 PLUS Range

The 1336 PLUS MCB and option card assemblies interface with the drive's internal SCANport backplane bus. Functional verification of these boards requires drive-level communication testing, not component-level bench testing alone. DriveKNMS applies the following test protocol to all 1336 PLUS boards prior to dispatch:

• Power-on self-test (POST): Board is installed in a 1336-compatible test chassis; firmware boot sequence and LED status codes are verified against Rockwell diagnostic tables.
• SCANport communication test: A HIM is connected to the SCANport port; parameter read/write cycles are executed to confirm bus integrity.
• Analog I/O calibration: All analog input and output channels are verified against reference signals (0–10V, 4–20mA) using calibrated instrumentation.
• Digital I/O functional test: All digital inputs and relay outputs are cycled through their full operating range.
• Thermal cycling: Boards are subjected to a 0°C to 55°C thermal cycle to identify latent solder joint failures before dispatch review.
• Final inspection: Visual inspection for component damage, corrosion, and connector integrity; results logged against the board's serial number.