Applied Materials PCB ASSY Modules: 0100-01577
Applied Materials 0100-01577 is listed for Controller Cards RFQ review. Confirm quantity, condition and destination before quotation.
Model: 0140-12304 0020-70424 CK88YP200V03 FOR MSD261Y70 581B345E
Product Overview
Commercial availability is handled through direct RFQ, model verification and export-oriented follow-up rather than public cart checkout.
Datasheet Preview
Use attached product manuals when available. If the manual is not public yet, request the full file directly through RFQ.
Commercial Path
Product pages on DRIVEKNMS are designed to verify model, brand and series first, then move the buyer into one clean quotation path.
Technical Dossier
DriveKNMS maintains RFQ-reviewed sourcing status of the Applied Materials 0140-12304 / 0020-70424 / CK88YP200V03 Harness Assembly. This is not a catalog listing. Inventory is finite and allocated on a first-confirmed basis.
RFQ support for obsolete parts: Send the model number, required quantity and destination so DriveKNMS can confirm sourcing options before quotation.
| Field | Detail |
|---|---|
| Manufacturer | Applied Materials (AMAT) |
| Primary Part Number | 0140-12304 |
| Secondary Part Number | 0020-70424 |
| Vendor Reference | CK88YP200V03 |
| Compatible Assembly | MSD261Y70 / 581B345E |
| Part Category | Harness Assembly (Cable/Wiring Loom) |
| Country of Origin | United States |
| OEM Status | Discontinued / Obsolete – No longer available through Applied Materials standard supply chain |
| Application | Semiconductor process chamber wiring interconnect |
Applied Materials' MSD261Y70 platform was deployed extensively in 200mm and transitional 300mm fab environments during a period when semiconductor manufacturers were scaling capacity rapidly. Many of these systems remain in active production today — not because operators are unaware of newer platforms, but because the cost and disruption of a full tool replacement cannot be justified against the remaining productive life of the chamber.
The 0140-12304 harness assembly serves as the electrical interconnect backbone for chamber subsystems. Degradation in this component — through insulation breakdown, connector oxidation, or mechanical fatigue from thermal cycling — directly affects process repeatability and chamber matching. In a production environment where wafer-to-wafer consistency is measured in angstroms, a compromised harness is not a minor maintenance issue. It is a yield risk.
DriveKNMS applies a 5-step inspection protocol to all obsolete harness assemblies before dispatch review:
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Move from this exact model into the matching system hub, brand archive, model-family archive or lifecycle sourcing route before sending a final RFQ list.