Applied Materials Radiance Emissometer Modules 0190-06301 BR940121 023-001448-1 ES023-001448-1 879-706-00 AD706

Technical Dossier

Product Details And Specifications

Applied Materials Radiance Emissometer Series Technical Notes

The Applied Materials Radiance Emissometer series is a family of in-situ, non-contact temperature and emissivity measurement instruments deployed across advanced semiconductor fabrication environments. These instruments are integrated into Applied Materials' Centura, Producer, and Endura platform process chambers, where accurate wafer temperature measurement is critical to process repeatability in CVD, RTP, and epitaxial growth applications. The Radiance Emissometer is installed in high-volume fabs operated by TSMC, Samsung, Intel, and GlobalFoundries, as well as in specialty compound semiconductor lines serving defense and photonics sectors. Its architecture is based on multi-wavelength pyrometry combined with emissivity compensation algorithms, enabling accurate temperature readings on low-emissivity silicon wafers without physical contact. The series has been a reference standard in semiconductor thermal metrology for over two decades and remains active in installed base maintenance programs globally.

The Evolution of Radiance Emissometer Architecture

The Radiance Emissometer platform was introduced by Applied Materials in the early 1990s as a response to the limitations of thermocouple-based wafer temperature measurement in RTP and CVD chambers. The first-generation units used single-wavelength pyrometry and required manual emissivity calibration per process recipe. By the mid-1990s, the architecture evolved to incorporate dual-wavelength ratio pyrometry, which partially compensated for emissivity variation across different wafer surface conditions (bare silicon, oxide-coated, nitride-coated).

The AD706 and related emissometer assemblies represent the mature third-generation architecture, incorporating integrated emissivity reference standards (low-emissivity reference wafers such as the BR940121 blackbody reference) and digital signal processing boards. The 023-001448-1 and ES023-001448-1 designations correspond to the emissometer sensor head and its enhanced-sensitivity variant respectively, while the 879-706-00 is the associated signal conditioning PCB assembly. The 0190-06301 is the top-level assembly part number used in Applied Materials' internal BOM structure.

Compatibility considerations: First-generation Radiance units are not electrically compatible with third-generation signal processing boards without adapter harnesses. Firmware versions must be matched to the specific chamber controller revision. Replacement of sensor heads (023-001448-1) requires recalibration of the emissivity offset table stored in the chamber recipe database.

Radiance Emissometer Full Catalog & Functionalities (SKU List)

Emissometer Assembly & Top-Level Part Numbers

• 0190-06301: Top-level Radiance Emissometer assembly BOM number; references complete sensor + electronics kit for Centura RTP chambers.
• AD706: Emissometer detector module designation; multi-wavelength InGaAs photodetector array assembly for 900–1100 nm range.
• 879-706-00: Signal conditioning PCB assembly; analog front-end for emissometer photodetector output, includes 16-bit ADC and isolation stage.
• BR940121: Blackbody reference standard wafer assembly; used for in-situ emissivity calibration at 940 nm reference wavelength.
• 023-001448-1: Emissometer sensor head assembly; primary optical pickup unit with fiber bundle and collimating optics for standard emissivity range wafers.
• ES023-001448-1: Enhanced-sensitivity emissometer sensor head; optimized for low-emissivity wafers (<0.1 emissivity) including polished backside silicon.

Optical & Fiber Components

• 0190-09876: Fiber optic bundle assembly, 1.5 m; connects sensor head to remote detector module in Centura chamber configurations.
• 0190-09877: Fiber optic bundle assembly, 3.0 m; extended-length variant for Producer GT chamber geometries.
• 0190-11234: Sapphire viewport window assembly; high-temperature optical access port for emissometer line-of-sight to wafer surface.
• 0190-11235: Viewport purge assembly; nitrogen purge fitting for sapphire viewport to prevent deposition fouling on optical surface.

Electronics & PCB Assemblies

• 0190-07412: Emissometer controller PCB; digital signal processor board handling emissivity algorithm computation and RS-422 output to chamber controller.
• 0190-07413: Emissometer power supply board; ±15 V and +5 V regulated supply for detector and signal conditioning circuits.
• 0190-08801: Analog output isolation board; provides 4–20 mA isolated output for integration with third-party DCS systems.
• 0190-08802: Digital I/O interface board; TTL-level handshake signals for emissometer ready/fault status to chamber PLC.

Calibration & Reference Standards

• BR940122: Secondary blackbody reference wafer; 940 nm calibration standard for periodic field verification without chamber venting.
• 0190-12001: Emissivity calibration kit; includes reference wafers, calibration procedure documentation, and NIST-traceable calibration certificate.
• 0190-12002: Temperature verification kit; includes calibrated thermocouple wafer for cross-validation of emissometer readings against contact measurement.

Quality Control for the Radiance Emissometer Range

The Radiance Emissometer series presents specific quality verification challenges due to its combination of precision optical components, analog signal conditioning electronics, and calibrated reference standards. DriveKNMS applies the following test protocol to all Radiance Emissometer assemblies prior to shipment:

• Optical continuity verification: Fiber optic bundles are tested for transmission efficiency at 940 nm using a calibrated light source and power meter. Bundles with >15% transmission loss relative to OEM specification are rejected.
• Detector responsivity check: AD706 detector modules are characterized for spectral responsivity across the 900–1100 nm range using a monochromator and calibrated reference detector. Units outside ±10% of OEM responsivity specification are flagged for further evaluation.
• PCB functional test: Signal conditioning boards (879-706-00) and controller PCBs (0190-07412) are powered and tested for correct analog output levels, ADC linearity, and digital communication integrity on RS-422 and TTL interfaces.
• Reference wafer verification: BR940121 and BR940122 blackbody reference wafers are inspected for surface condition and measured for emissivity at 940 nm using an independent calibrated emissometer. Units deviating >2% from nominal emissivity value are rejected.
• Assembly-level functional test: Complete emissometer assemblies (0190-06301) are tested as a system using a temperature-controlled blackbody source, verifying end-to-end temperature measurement accuracy within ±3°C across the 400–1100°C operating range.