Applied Materials 0270-03850 0040-48318 TT2301R2-1-NES-LAM 27-326390-00 Cover Top Ship Assembly 300MM

Technical Dossier

Product Details And Specifications

Applied Materials 300MM Chamber Assembly Series: Comprehensive Spare Parts Range and Technical Overview

The Evolution of Applied Materials 300MM Chamber Assembly Architecture

Applied Materials transitioned its primary process chamber platforms from 200mm to 300mm wafer compatibility beginning in the late 1990s, with full production-scale deployment of 300mm tools accelerating through 2002–2008 across its Producer, Centura, and Endura platform families. The Cover Top Ship Assembly evolved across this period to accommodate larger chamber diameters, higher RF power densities, and more aggressive process chemistries (fluorine-based etch, PECVD, ALD). Early 300mm cover assemblies used aluminum alloy construction with anodized surface treatment; later generations incorporated yttria-coated or ceramic-lined variants to extend service life under high-plasma-exposure conditions. Cross-platform compatibility between Centura and Producer chamber generations is limited — part numbers must be matched to the specific chamber type, process kit revision, and tool serial range. Many of these assemblies are now in the mature-to-end-of-life phase of their product lifecycle, meaning OEM supply has been discontinued or severely constrained, making third-party MRO sourcing the primary procurement channel for ongoing fab maintenance.

Applied Materials 300MM Chamber Assembly Full Catalog & Functionalities (SKU List)

The following part numbers represent verified Applied Materials 300mm chamber and sub-assembly components commonly sourced for Centura, Producer, and Endura platform maintenance. Each entry reflects a distinct functional role within the chamber stack:

0270-03850: Cover Top Ship Assembly, 300MM — primary upper chamber enclosure, vacuum-rated structural cover for 300mm process module.
0040-48318: Cover Top Ship Assembly cross-reference / alternate configuration number for 300MM etch chamber platforms.
TT2301R2-1-NES-LAM: Vendor/fab-specific revision identifier for the Cover Top Ship Assy, NES-LAM process configuration.
27-326390-00: Assembly drawing / configuration control number for the 300MM Cover Top Ship Assy revision 00.
0270-09530: Lid Assembly, 300MM Centura — upper chamber lid for Centura DxZ and eMax chamber configurations.
0040-76508: Cover, Chamber Body — lower chamber body cover plate, 300MM Producer platform.
0270-02885: Liner, Chamber — replaceable process kit liner for 300MM CVD chamber, anodized aluminum.
0040-95188: Ring, Focus — electrostatic focus ring for 300MM etch chamber, consumable process kit component.
0021-22023: Showerhead Assembly, 300MM — gas distribution faceplate for PECVD/ALD process modules.
0040-39728: Shield, Chamber — RF and plasma containment shield, 300MM Centura etch module.
0270-07498: Dome, Quartz — upper quartz dome for 300MM RTP (Rapid Thermal Processing) chamber.
0040-76512: Plate, Base — chamber base plate assembly, 300MM Producer CVD platform.
0021-19581: Susceptor Assembly, 300MM — wafer support susceptor for high-temperature CVD process modules.
0040-88135: Ring, Edge Exclusion — edge exclusion ring for 300MM etch chamber, process kit consumable.
0270-04112: Assembly, Slit Valve Door — vacuum isolation slit valve door assembly, 300MM chamber interface.
0040-55678: Clamp Ring, 300MM — wafer clamp ring for mechanical wafer retention in etch process modules.
0021-34402: Heater Assembly, 300MM — resistive heater block for temperature-controlled CVD chamber base.
0040-91234: Baffle, Gas Distribution — secondary gas baffle plate for uniform flow distribution, 300MM PECVD module.