B&R Automation PC 810 (5PC810) Modules — 5PC810.SX05-00

Technical Dossier

Product Details And Specifications

B&R 5PC810 Series: Comprehensive Module Range and Technical Overview

The B&R Automation PC 810 (5PC810) series is a panel-integrated industrial PC platform engineered by Bernecker + Rainer Industrie-Elektronik GmbH (Austria). It is deployed across heavy-process industries including petrochemical refining, nuclear power auxiliary systems, pharmaceutical batch control, and continuous steel production lines. The 5PC810 platform integrates x86-based computing with B&R's APROL and Automation Studio environments, enabling deterministic real-time control alongside standard HMI and SCADA functions on a single hardware chassis. Its fanless and semi-fanless thermal management options make it suitable for Class 1 Div 2 adjacent environments where particulate contamination is a disqualifying factor for conventional industrial PCs. Global installed base spans facilities operated by major EPC contractors and OEMs across Europe, North America, and Asia-Pacific.

The Evolution of 5PC810 Architecture

The 5PC810 series was introduced as a successor to the earlier B&R Automation PC 620 (5PC600) and Automation PC 720 (5PC720) platforms. The architectural progression followed three distinct phases:

Phase 1 — Early Deployment (SX01 / SX02 variants): Intel Celeron M and Pentium M processors, single-channel DDR2 memory, CompactFlash primary storage, Windows XP Embedded and B&R Automation Runtime 3.x. These units are now fully end-of-life (EOL) with no manufacturer support. Compatibility with Automation Studio 4.x requires legacy project migration.

Phase 2 — Mid-Generation Refresh (SX03 / SX04 variants): Transition to Intel Core 2 Duo and Atom N270 processors, DDR3 memory support, SATA SSD options introduced, Windows 7 Embedded Standard. Automation Runtime 4.x compatibility confirmed. USB 2.0 expansion standardized across the lineup.

Phase 3 — Current Production (SX05 / SX06 variants): Intel Core i3/i5/i7 (Haswell / Broadwell generation), dual-channel DDR3L, onboard Intel HD Graphics, SATA III SSD, Windows 10 IoT Enterprise LTSB. The 5PC810.SX05-00 represents the baseline SX05 configuration — a fanless panel PC with integrated display interface, designed for front-panel mounting in control cabinet doors. Automation Studio 4.9+ and Automation Runtime 4.9+ are the validated software environments for this hardware revision. Backward compatibility between SX05 hardware and SX01/SX02-era software projects requires CPU load profiling and I/O driver re-validation.

5PC810 Full Catalog & Functionalities (SKU List)

Panel PC Base Units — CPU / Display Integration

• 5PC810.SX01-00: Celeron M 600 MHz panel PC, 256 MB RAM, CF slot, 5.7-inch display interface — EOL
• 5PC810.SX02-00: Pentium M 1.1 GHz panel PC, 512 MB DDR2, CF + SATA, 8.4-inch display interface — EOL
• 5PC810.SX02-01: Pentium M 1.1 GHz extended temperature range variant, 512 MB DDR2 — EOL
• 5PC810.SX03-00: Core 2 Duo 1.2 GHz, 1 GB DDR3, SATA SSD ready, 10.4-inch display interface — limited support
• 5PC810.SX04-00: Atom N270 1.6 GHz, 1 GB DDR3, low-power fanless design, 12.1-inch display interface — limited support
• 5PC810.SX04-01: Atom N270 1.6 GHz extended I/O variant, dual USB 2.0 — limited support
• 5PC810.SX05-00: Core i3 (Haswell) fanless panel PC, 4 GB DDR3L, SATA III SSD, Intel HD Graphics — current production
• 5PC810.SX05-01: Core i5 (Haswell) variant, 8 GB DDR3L, enhanced graphics output — current production
• 5PC810.SX05-02: Core i7 (Haswell) high-performance variant, 16 GB DDR3L, dual display support — current production
• 5PC810.SX06-00: Core i3 (Broadwell) next-generation panel PC, 8 GB DDR4, USB 3.0 — current production
• 5PC810.SX06-01: Core i5 (Broadwell), 16 GB DDR4, dual GbE — current production

Expansion & Interface Modules

• 5PC810.EX01-00: PCI expansion chassis, 2-slot passive backplane, mounts adjacent to panel PC unit
• 5PC810.EX02-00: PCIe x4 expansion module, single-slot, for fieldbus adapter cards (PROFIBUS, CANopen)
• 5PC810.IF01-00: RS-232/RS-422/RS-485 serial interface module, DIN-rail mountable, connects via internal USB
• 5PC810.IF02-00: Dual GbE interface expansion card, Intel I350 chipset, for redundant network topologies

Power Supply & Accessory Modules

• 5PC810.PS01-00: 24 VDC panel power supply module, 60 W, UPS-ready, for cabinet installations
• 5PC810.AC01-00: Panel mounting accessory kit, VESA 75/100 compatible, stainless hardware
• 5PC810.AC02-00: Replacement thermal interface pad set for SX05/SX06 heatsink assemblies

Sourcing Hard-to-Find & Obsolete 5PC810 Parts

DriveKNMS maintains a dedicated inventory program for the 5PC810 series, with particular focus on SX01, SX02, and SX03 variants that have passed B&R's official end-of-life date. For facilities operating legacy APROL or Automation Runtime 3.x environments — where a hardware upgrade would require full software re-validation, a process that can exceed six months in regulated industries — like-for-like hardware replacement is the operationally preferred path.

DriveKNMS sources 5PC810 units through decommissioned plant buybacks, controlled factory surplus channels, and certified refurbishment pipelines. All units are inspected against original B&R hardware revision documentation. Firmware versions are verified and documented prior to shipment. For EOL variants, DriveKNMS provides a minimum 12-month warranty with optional extended coverage for multi-unit procurement contracts. Customers requiring cross-reference support — for example, identifying a compatible SX05-00 replacement for a failed SX03-00 where software re-validation is feasible — can submit their part number and system configuration for a compatibility assessment at no charge.

Quality Control for the 5PC810 Range

The 5PC810 platform presents specific test requirements due to its integrated panel PC architecture, where display controller, CPU board, and I/O interface are housed within a single sealed chassis. DriveKNMS applies the following protocol to all 5PC810 units:

• Power-on and POST verification: Full BIOS POST cycle confirmed; hardware revision and serial number logged against B&R hardware identification records.
• CPU and memory stress test: 4-hour burn-in using Prime95 and MemTest86 to identify latent thermal or memory cell failures common in high-duty-cycle deployments.
• Storage media assessment: SMART data extraction and sector-level read verification on all SATA SSD and CompactFlash devices. Failed or marginal media replaced before shipment.
• Display interface test: LVDS and DisplayPort signal integrity verified using calibrated test panels. Backlight driver output measured against OEM specification.
• I/O port functional test: All USB, RS-232, Ethernet, and DVI/VGA ports tested under load using loopback adapters and network traffic generation tools.
• Automation Runtime boot test: Where applicable, units are booted into B&R Automation Runtime to confirm PLC runtime initialization and I/O scan cycle integrity.
• Thermal imaging: Infrared scan performed under load to identify abnormal heat distribution patterns indicative of failing capacitors or dry solder joints on the CPU board.