GE IS200 Series Modules: IS200TSVCH1ACB
General Electric IS200TSVCH1ACB is listed for IS200 Series RFQ review. Confirm quantity, condition and destination before quotation.
Model: IS200EHPAG1AFD
Product Overview
Commercial availability is handled through direct RFQ, model verification and export-oriented follow-up rather than public cart checkout.
Datasheet Preview
Use attached product manuals when available. If the manual is not public yet, request the full file directly through RFQ.
Commercial Path
Product pages on DRIVEKNMS are designed to verify model, brand and series first, then move the buyer into one clean quotation path.
Technical Dossier
The IS200 module family was introduced as part of the Mark VI control system in the mid-1990s, succeeding the earlier Mark V (IS200 predecessor boards used in TCCA/TCDB racks). The Mark VI platform standardized on VME-based backplane architecture with dedicated IONET and ARCNET communication buses, enabling deterministic real-time control loops at sub-10ms cycle times.
Early IS200 revisions (suffix A, B) established the base electrical specifications. Subsequent revisions (C, D) addressed field-reported EMI susceptibility issues and improved conformal coating for high-humidity environments. By the mid-2000s, GE transitioned long-term support to the Mark VIe platform (IS420 series), which introduced Ethernet-based IONet replacing the legacy coaxial ARCNET topology. As a result, the entire IS200 series entered a mature/end-of-active-production phase. GE ceased new manufacturing of most IS200 boards circa 2010–2015, making third-party refurbished and surplus inventory the primary sourcing channel for ongoing maintenance. Compatibility between IS200 revisions requires careful attention: firmware version on the UCCE/UCCA controller must match the board revision table published in GEH-6421 (Mark VI System Guide).
The following SKUs represent verified, commonly stocked IS200 series modules. Classified by functional category:
Excitation & Power Electronics
I/O & Signal Conditioning
Control & Processing
IS200 boards present specific test challenges due to their multi-layer PCB construction, ARCNET/IONET bus transceivers, and mixed analog-digital signal paths. DriveKNMS applies the following test protocol to all IS200 modules prior to shipment:
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