Honeywell FSC Modules: 10024/H/I,

Model: 10024/H/I

Brand Honeywell
Series FSC
Model 10024/H/I
RFQ-ready model route Obsolete and surplus sourcing Export follow-up by model list

Product Overview

Commercial availability is handled through direct RFQ, model verification and export-oriented follow-up rather than public cart checkout.

Datasheet Preview

Datasheet Preview

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Commercial Path

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Technical Dossier

Product Details And Specifications

Honeywell FSC Series Technical Notes

The Evolution of FSC Architecture

The FSC platform was introduced by Fail-Safe Systems (later acquired by Honeywell) in the late 1980s as a dedicated hardware-based safety controller. The original architecture used a 1oo1D (one-out-of-one with diagnostics) voting structure, later expanded to 1oo2D and 2oo3 configurations to meet evolving SIL requirements. Early CPU modules operated on proprietary backplane buses with fixed-cycle scan times. The 10024/H/I CPU module represents the mature generation of this architecture, featuring enhanced memory capacity, improved self-test coverage, and compatibility with the FSC Engineering Tool (ET) software suite.

FSC Full Catalog & Functionalities (SKU List)

The following SKUs represent verified, commonly sourced components within the Honeywell FSC platform. Modules are classified by functional category.

CPU / Processor Modules

  • 10024/H/I: FSC High Integrity CPU module, SIL 3 capable, primary processing unit with self-diagnostics.
  • 10022/H/I: FSC CPU module, earlier revision, 1oo1D architecture, compatible with standard FSC backplanes.
  • 10023/H/I: FSC CPU module, intermediate revision, enhanced memory map, used in 2oo3 voting configurations.
  • 10025/H/I: FSC CPU module, extended temperature range variant for harsh environment enclosures.

Digital Input (DI) Modules

  • 10204/H/I: 24 VDC digital input module, 16-channel, SIL 2 rated, with per-channel diagnostics.
  • 10205/H/I: 24 VDC digital input module, 32-channel, high-density configuration for large I/O counts.
  • 10206/H/I: 120 VAC digital input module, 16-channel, for legacy field wiring compatibility.
  • 10210/H/I: Solenoid driver input module, 24 VDC, 8-channel, with open-circuit and short-circuit detection.

Digital Output (DO) Modules

  • 10304/H/I: 24 VDC digital output module, 16-channel, solid-state relay outputs, SIL 2 rated.
  • 10305/H/I: 24 VDC digital output module, 32-channel, high-density, with load monitoring diagnostics.
  • 10306/H/I: Relay output module, 8-channel, dry contact, for final element actuation in ESD loops.

Analog Input (AI) Modules

  • 10404/H/I: Analog input module, 8-channel, 4–20 mA, 12-bit resolution, HART pass-through capable.
  • 10405/H/I: Analog input module, 16-channel, 4–20 mA, with per-channel range checking and fault reporting.
  • 10406/H/I: Thermocouple/RTD input module, 8-channel, for temperature measurement in process safety loops.

Communication & Backplane Modules

  • 10001/H/I: FSC backplane, 8-slot, standard rack, primary chassis for CPU and I/O module mounting.
  • 10002/H/I: FSC backplane, 16-slot, extended rack, for high I/O density installations.
  • 10501/H/I: Modbus RTU communication module, for integration with DCS historian and operator stations.
  • 10502/H/I: Profibus DP communication adapter, for fieldbus-connected instrument integration.
  • 10503/H/I: Ethernet communication module, for FSC-to-DCS network integration via Modbus TCP.

Power Supply Modules

  • 10701/H/I: FSC power supply module, 24 VDC input, redundant configuration support, with voltage monitoring.
  • 10702/H/I: FSC power supply module, 120/240 VAC input, for direct mains-powered installations.

Quality Control for the FSC Range

FSC modules present specific test challenges due to their integrated backplane bus communication, self-test firmware routines, and voting logic that must be exercised under controlled conditions. DriveKNMS applies a structured test protocol for all FSC modules prior to dispatch. CPU modules (including the 10024/H/I) are powered on a reference backplane, firmware version is read and recorded, self-diagnostic routines are allowed to complete a full cycle, and communication with the ET software is verified. I/O modules are tested for channel-level continuity, isolation resistance between channels and chassis ground, and correct response to simulated field signals. Communication modules are tested for protocol handshake and data integrity under load. All test results are documented and accompany the shipment. Modules that fail any test parameter are quarantined and not offered for sale.

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