LAM VME LTNI-S5 Power Supply Module – Obsolete VME Series Spare Part
LAM VME LTNI-S5 Power Supply Module – Obsolete VME Series Spare Part When a VME-bus power supply module fails on…
Model: 853-054147-001 853-54127-001 3151701-010 17-291211-00
Product Overview
Commercial availability is handled through direct RFQ, model verification and export-oriented follow-up rather than public cart checkout.
Datasheet Preview
Use attached product manuals when available. If the manual is not public yet, request the full file directly through RFQ.
Commercial Path
Product pages on DRIVEKNMS are designed to verify model, brand and series first, then move the buyer into one clean quotation path.
Technical Dossier
Lam Research liquid pump assemblies are critical fluid-handling components deployed across semiconductor fabrication equipment, including Lam's ALTUS, VECTOR, SPEED, and Kiyo etch platforms. These pumps manage the precise delivery and recirculation of process chemicals — including slurries, DI water, and etchants — in environments where contamination, flow deviation, or pressure inconsistency directly impacts wafer yield. Installed in fabs operated by TSMC, Samsung, Intel, SK Hynix, and Micron, Lam Research liquid pump modules represent a high-reliability, application-specific class of fluid control hardware. Their design integrates corrosion-resistant wetted materials (PTFE, PVDF, or PFA-lined internals), precision flow control, and compatibility with Lam's proprietary process module architecture.
Early-generation Lam Research liquid pump assemblies were designed for 200mm wafer process tools, characterized by single-channel peristaltic or diaphragm-based mechanisms with manual flow calibration. As the industry transitioned to 300mm wafer processing in the early 2000s, Lam redesigned its fluid delivery subsystems to support higher throughput, tighter chemical dosing tolerances, and integration with automated process control (APC) loops.
The pump assemblies referenced by part numbers such as 853-054147-001, 853-54127-001, 3151701-010, and 17-291211-00 represent mid-to-late generation components engineered for compatibility with Lam's modular process chamber architecture. These parts are cross-referenced across multiple tool generations, indicating their role as platform-level components rather than tool-specific consumables. As Lam's newer platforms (e.g., Sense.i, Kiyo G series) adopt integrated fluid management subsystems, these pump assemblies have entered the mature/end-of-life phase of their product lifecycle — making reliable aftermarket sourcing essential for fabs maintaining legacy tool fleets.
The following part numbers represent verified Lam Research liquid pump and fluid-handling components across multiple platform generations. Each entry includes a concise functional description:
853-054147-001: Primary liquid pump assembly, process chemical delivery module
853-54127-001: Liquid pump sub-assembly, compatible with ALTUS/VECTOR platforms
3151701-010: Fluid recirculation pump module, 300mm process tool variant
17-291211-00: Pump drive assembly, diaphragm-type, corrosion-resistant wetted path
853-049766-001: Chemical pump head, PTFE-lined, high-purity fluid service
853-062341-001: Liquid delivery pump, peristaltic type, slurry-compatible
853-038721-001: Pump motor assembly, brushless DC, closed-loop speed control
3151500-001: Fluid pump manifold block, multi-port chemical distribution
17-300456-00: Pump inlet/outlet valve assembly, pneumatically actuated
853-071234-001: Chemical recirculation pump, low-pulsation diaphragm design
853-055892-001: Pump controller PCB, flow rate feedback and fault detection
3152200-005: Liquid pump tubing set, PFA-lined, process-compatible replacement kit
17-285634-00: Pump seal kit, FFKM O-rings, high-temperature chemical service
853-043210-001: Pump pressure transducer assembly, inline process monitoring
853-067890-001: Liquid pump isolation valve, PVDF body, pneumatic actuator
3151900-003: Pump flow meter module, ultrasonic type, non-contact measurement
17-310022-00: Pump drive belt and pulley kit, peristaltic pump maintenance set
As Lam Research transitions its installed base toward next-generation platforms, pump assemblies such as the 853-054147-001 and 3151701-010 are no longer available through standard OEM distribution channels. DriveKNMS maintains a dedicated inventory of Lam Research fluid-handling components sourced through certified secondary market channels, decommissioned tool teardowns, and long-term storage partnerships with semiconductor equipment brokers globally.
For fabs operating under extended tool lifecycle programs — common in mature node production (28nm and above), MEMS, compound semiconductor, and legacy DRAM fabs — DriveKNMS provides lifecycle extension support including cross-reference matching, functional equivalency verification, and multi-unit lot sourcing. All obsolete pump assemblies are inspected, cleaned, and tested prior to shipment. Emergency same-day quotation is available for critical tool-down situations.
Liquid pump modules present unique QC challenges due to their wetted internal components, dynamic sealing surfaces, and sensitivity to particulate contamination. DriveKNMS applies the following test protocol to all Lam Research pump assemblies prior to dispatch:
Leak integrity test: Pressurized DI water or inert gas leak-down test across all inlet/outlet ports and seal interfaces. Flow rate verification: Pump output measured against OEM specification at rated operating pressure using calibrated flow bench equipment. Motor and drive inspection: Brushless DC motor winding resistance, insulation resistance (IR), and back-EMF checked against baseline. Wetted surface inspection: Internal PTFE/PVDF/PFA surfaces inspected under UV and white light for cracking, chemical staining, or particulate embedment. Functional run-in: Each pump assembly is operated for a minimum 2-hour run-in cycle under load conditions before final packaging. Contamination control: All tested units are double-bagged in ESD-safe, cleanroom-compatible packaging with desiccant and nitrogen purge where applicable.