Siemens TELEPERM M 6DS1722-8BB Analog Module

Technical Dossier

Product Details And Specifications

Siemens TELEPERM M Series Technical Notes

The Evolution of TELEPERM M Architecture

TELEPERM M was architected around a proprietary serial backplane bus (SINEC H1 / CS 275) that allowed deterministic, cyclic data exchange between I/O modules, controllers, and operator stations. The system evolved through three distinct hardware generations. The first generation (late 1970s–mid 1980s) established the 6DS module form factor: eurocard-format boards housed in standardized 19-inch subrack assemblies with passive backplanes. Analog signal processing relied on discrete op-amp circuits with 12-bit resolution. The second generation (mid 1980s–mid 1990s) introduced microprocessor-based modules, expanded the analog resolution to 13–14 bits, and added self-diagnostic routines accessible via the CS 275 bus. The 6DS1722-8BB belongs to this generation as a multi-channel analog input module. The third generation (late 1990s–2000s) introduced TELEPERM XP (6DS9xxx series) as the migration path, offering backward compatibility with existing CS 275 wiring infrastructure while adding Ethernet-based supervisory connectivity. As of 2026, TELEPERM M hardware is fully discontinued by Siemens, with no new production. All 6DS modules are classified as End-of-Life (EOL). Compatibility between generations is constrained by backplane slot addressing and bus protocol version; cross-generation substitution requires engineering validation.

TELEPERM M Full Catalog & Functionalities (SKU List)

The following SKUs represent verified, commonly sourced modules within the Siemens TELEPERM M 6DS product family. Modules are classified by functional category.

Analog Input / Output Modules

• 6DS1722-8BB: Multi-channel analog input module, 4–20 mA / 0–10 V, 13-bit resolution, CS 275 bus interface
• 6DS1721-8AA: Analog input module, 8-channel, thermocouple/RTD compatible, cold junction compensation
• 6DS1723-8AA: Analog output module, 4-channel, 4–20 mA, 12-bit DAC, galvanic isolation per channel
• 6DS1724-8AA: Analog output module, 8-channel, 0–10 V / 4–20 mA selectable, backplane-powered
• 6DS1726-8AA: High-accuracy analog input module, 16-channel multiplexed, 14-bit ADC, for precision process measurement

Digital Input / Output Modules

• 6DS1711-8AA: Digital input module, 16-channel, 24 V DC, optocoupler isolated, status LED per channel
• 6DS1712-8AA: Digital input module, 32-channel, 24 V DC, grouped commons, high-density I/O expansion
• 6DS1713-8AA: Digital output module, 16-channel, 24 V DC / 0.5 A, short-circuit protected relay driver
• 6DS1714-8AA: Digital output module, 32-channel, transistor output, 24 V DC, fast switching for solenoid control
• 6DS1715-8AB: Mixed DI/DO module, 8 inputs + 8 outputs, 24 V DC, compact form factor for small loop control

CPU / Controller Modules

• 6DS1600-8AA: Central processing unit, TELEPERM M main controller, CS 275 bus master, 256 KB RAM, real-time OS
• 6DS1601-8AA: Redundant CPU module, hot-standby configuration, automatic bumpless transfer, for SIL-rated loops
• 6DS1610-8AA: Function module controller, pre-programmed PID and sequence control blocks, configurable via PROGRAF AP

Communication & Bus Adapter Modules

• 6DS1900-8AA: CS 275 bus coupler, inter-rack communication, supports up to 8 remote I/O stations at 500 m distance
• 6DS1901-8AA: SINEC H1 Ethernet gateway module, bridges CS 275 field bus to plant-level LAN, supports FTP data export
• 6DS1910-8AA: Optical fiber bus repeater, extends CS 275 bus segment in electrically noisy environments (refineries, arc furnace areas)

Power Supply Modules

• 6DS1800-8AA: Subrack power supply, 24 V DC input, regulated 5 V / 15 V backplane output, 10 A continuous, over-voltage protected
• 6DS1801-8AA: Redundant power supply module, N+1 configuration, automatic load sharing, hot-swap capable

Quality Control for the TELEPERM M Range

TELEPERM M modules present specific test challenges due to their proprietary CS 275 backplane bus protocol and mixed analog/digital signal architecture. DriveKNMS operates a dedicated TELEPERM M test bench that replicates the original subrack environment, including a live CS 275 bus master and calibrated analog signal sources. Each 6DS module undergoes the following verification sequence: visual inspection for capacitor degradation, PCB corrosion, and connector wear; powered bus enumeration to confirm correct module address response; analog channel calibration verification against NIST-traceable reference signals (±0.1% accuracy); digital I/O functional test across all channels at rated voltage; and 48-hour burn-in under cyclic load to screen for latent component failures. Modules that pass all stages are issued a DriveKNMS test certificate with individual channel measurement records. Modules with repairable faults (failed op-amps, blown fuses, degraded electrolytic capacitors) are repaired using original-specification components before re-testing. No module is dispatched without a passing test record.