Siemens 505 Series Modules – C6M9HH03C

Technical Dossier

Product Details And Specifications

Siemens 505 Series Technical Notes

The Siemens SIMATIC 505 Series (originally developed by Texas Instruments as the TI505 and later acquired by Siemens) is a mature, rack-based programmable logic controller platform with a documented installation base across global heavy industry sectors including petrochemical refineries, nuclear power facilities, pulp and paper mills, and continuous-process chemical plants. Its modular backplane architecture, deterministic scan cycle, and robust I/O density made it a preferred platform for large-scale process automation from the 1980s through the early 2000s. Many facilities continue to operate 505 Series hardware as the cost and risk of migration to modern platforms (e.g., Siemens S7-400, S7-1500) remains prohibitive. DriveKNMS maintains an active spare parts inventory for this series to support lifecycle extension programs.

The Evolution of 505 Series Architecture

The 505 platform originated as the Texas Instruments Series 505 PLC in the early 1980s, designed around a proprietary backplane bus with fixed slot addressing. Texas Instruments sold its industrial automation division to Siemens in 1992, after which the product line was rebranded as SIMATIC TI505 and later simply the Siemens 505 Series. The architecture evolved through several generations:

Generation 1 (TI505, 1982–1990): Original 5-slot and 10-slot chassis with discrete I/O modules and early CPU variants (505-CPU1, 505-CPU2). Bus communication was parallel, proprietary, and non-networked.

Generation 2 (SIMATIC TI505, 1992–1998): Siemens introduced enhanced CPU modules with expanded memory (505-CPU4, 505-CPU5), TIWAY network adapters for peer-to-peer communication, and analog I/O modules with improved resolution. Compatibility with original TI505 chassis was maintained.

Generation 3 (Siemens 505, 1998–2006): Introduction of Ethernet-capable communication modules (505-CP2572), expanded analog ranges, and integration with STEP 7 programming environment. This generation represents the final active development phase before the platform entered maintenance-only status.

End-of-Life / Lifecycle Extension (2006–present): Siemens officially discontinued active development of the 505 Series. Spare parts availability shifted to third-party distributors and repair specialists. Migration paths to S7-300/400 were published. DriveKNMS provides sourcing and repair support for all three generations.

505 Series Full Catalog & Functionalities (SKU List)

Power Supply Modules

• C6M9HH03C: 505 Series rack power supply module; provides regulated DC bus power to backplane-mounted I/O and CPU modules.
• 505-6860: 120/240 VAC input power supply, 5 VDC / 24 VDC output; standard rack PSU for 10-slot chassis.
• 505-6865: Redundant power supply module; hot-swap capable; used in high-availability process control configurations.
• 505-6870: 24 VDC input power supply; designed for battery-backed or DC-bus plant environments.

CPU Modules

• 505-CPU1: Entry-level CPU; 4K word user memory; supports discrete I/O only; original TI505 generation.
• 505-CPU2: Mid-range CPU; 8K word memory; supports analog and discrete I/O; TIWAY-compatible.
• 505-CPU4: Enhanced CPU; 16K word memory; floating-point math; supports structured programming blocks.
• 505-CPU5: High-performance CPU; 32K word memory; dual-port memory for co-processor support; used in large continuous-process applications.
• 505-CPU6: Top-tier CPU; 64K word memory; supports redundant CPU configurations; Ethernet-ready with optional CP module.

Digital Input (DI) Modules

• 505-4401: 32-channel 24 VDC discrete input module; sink/source configurable; standard field wiring terminal.
• 505-4402: 16-channel 120 VAC discrete input module; optically isolated; for high-voltage field devices.
• 505-4404: 32-channel 48 VDC discrete input module; used in European-standard plant wiring environments.

Digital Output (DO) Modules

• 505-4501: 32-channel 24 VDC discrete output module; transistor (solid-state) output; 0.5A per channel.
• 505-4502: 16-channel relay output module; Form C contacts; 2A per channel; for motor starter and valve actuator control.

Analog Input (AI) Modules

• 505-4701: 8-channel analog input module; 4–20 mA / 0–10 VDC selectable; 12-bit resolution; for process transmitter signals.
• 505-4702: 16-channel analog input module; 12-bit resolution; high-density configuration for large process loops.
• 505-4711: 8-channel thermocouple input module; supports J, K, T, E, R, S, B types; cold junction compensation onboard.

Analog Output (AO) Modules

• 505-4801: 4-channel analog output module; 4–20 mA output; 12-bit resolution; for control valve positioners and variable speed drives.

Communication & Network Modules

• 505-CP2572: Ethernet TCP/IP communication processor; 10/100 Mbps; supports Modbus TCP and proprietary SIMATIC protocol.
• 505-6890: TIWAY network adapter; peer-to-peer communication between 505 Series racks; RS-485 physical layer.

Quality Control for the 505 Series Range

The 505 Series backplane uses a parallel proprietary bus with strict timing and impedance requirements. Standard bench testing is insufficient to validate module integrity. DriveKNMS applies the following test protocol to all 505 Series modules processed through its facility:

• Backplane Bus Simulation: Each module is seated in a live 505-compatible test chassis running a validated ladder logic program. Bus communication integrity is verified under load.
• Power Supply Load Testing: PSU modules (including C6M9HH03C) are tested at 25%, 50%, 75%, and 100% rated load. Output voltage ripple and regulation are measured against Siemens factory tolerances.
• I/O Channel Verification: All discrete and analog channels are individually stimulated and read-back verified. Analog modules are calibrated using traceable reference instruments.
• CPU Memory and Scan Cycle Test: CPU modules are loaded with a standardized test program. Memory integrity (RAM and EEPROM) is verified. Scan cycle time is measured and compared to factory specification.
• Thermal Soak: Modules are operated at elevated ambient temperature (50°C) for a minimum of 4 hours to screen for latent thermal failures.
• Visual and Component Inspection: PCB inspection for corrosion, damaged traces, failed capacitors, and counterfeit components prior to functional testing.