Sanken DK14256A Circuit Board: Specifications, Compatible Models & Availability
Sanken DK14256A Series: Comprehensive Module Range and Technical Overview The Sanken DK14256A is a purpose-built circuit board module deployed across…
Model: 0270-03850 0040-48318 TT2301R2-1-NES-LAM 27-326390-00
Product Overview
Commercial availability is handled through direct RFQ, model verification and export-oriented follow-up rather than public cart checkout.
Datasheet Preview
Use attached product manuals when available. If the manual is not public yet, request the full file directly through RFQ.
Commercial Path
Product pages on DRIVEKNMS are designed to verify model, brand and series first, then move the buyer into one clean quotation path.
Technical Dossier
Applied Materials (AMAT) is the world's largest supplier of semiconductor manufacturing equipment, with its 300mm process chamber platforms deployed across leading fabs operated by TSMC, Samsung, Intel, SK Hynix, and Micron. The Cover Top Ship Assembly — part numbers 0270-03850, 0040-48318, TT2301R2-1-NES-LAM, and 27-326390-00 — is a critical mechanical sub-assembly used in 300mm etch and CVD (Chemical Vapor Deposition) chamber configurations. These assemblies form the upper structural enclosure of the process chamber, providing vacuum integrity, gas distribution alignment, and RF shielding continuity during wafer processing. Downtime caused by a failed or worn cover assembly directly impacts wafer throughput and yield, making reliable spare part sourcing a tier-1 operational priority for fab equipment engineers and MRO procurement teams.
Applied Materials transitioned its primary process chamber platforms from 200mm to 300mm wafer compatibility beginning in the late 1990s, with full production-scale deployment of 300mm tools accelerating through 2002–2008 across its Producer, Centura, and Endura platform families. The Cover Top Ship Assembly evolved across this period to accommodate larger chamber diameters, higher RF power densities, and more aggressive process chemistries (fluorine-based etch, PECVD, ALD). Early 300mm cover assemblies used aluminum alloy construction with anodized surface treatment; later generations incorporated yttria-coated or ceramic-lined variants to extend service life under high-plasma-exposure conditions. Cross-platform compatibility between Centura and Producer chamber generations is limited — part numbers must be matched to the specific chamber type, process kit revision, and tool serial range. Many of these assemblies are now in the mature-to-end-of-life phase of their product lifecycle, meaning OEM supply has been discontinued or severely constrained, making third-party MRO sourcing the primary procurement channel for ongoing fab maintenance.
The following part numbers represent verified Applied Materials 300mm chamber and sub-assembly components commonly sourced for Centura, Producer, and Endura platform maintenance. Each entry reflects a distinct functional role within the chamber stack:
0270-03850: Cover Top Ship Assembly, 300MM — primary upper chamber enclosure, vacuum-rated structural cover for 300mm process module.
0040-48318: Cover Top Ship Assembly cross-reference / alternate configuration number for 300MM etch chamber platforms.
TT2301R2-1-NES-LAM: Vendor/fab-specific revision identifier for the Cover Top Ship Assy, NES-LAM process configuration.
27-326390-00: Assembly drawing / configuration control number for the 300MM Cover Top Ship Assy revision 00.
0270-09530: Lid Assembly, 300MM Centura — upper chamber lid for Centura DxZ and eMax chamber configurations.
0040-76508: Cover, Chamber Body — lower chamber body cover plate, 300MM Producer platform.
0270-02885: Liner, Chamber — replaceable process kit liner for 300MM CVD chamber, anodized aluminum.
0040-95188: Ring, Focus — electrostatic focus ring for 300MM etch chamber, consumable process kit component.
0021-22023: Showerhead Assembly, 300MM — gas distribution faceplate for PECVD/ALD process modules.
0040-39728: Shield, Chamber — RF and plasma containment shield, 300MM Centura etch module.
0270-07498: Dome, Quartz — upper quartz dome for 300MM RTP (Rapid Thermal Processing) chamber.
0040-76512: Plate, Base — chamber base plate assembly, 300MM Producer CVD platform.
0021-19581: Susceptor Assembly, 300MM — wafer support susceptor for high-temperature CVD process modules.
0040-88135: Ring, Edge Exclusion — edge exclusion ring for 300MM etch chamber, process kit consumable.
0270-04112: Assembly, Slit Valve Door — vacuum isolation slit valve door assembly, 300MM chamber interface.
0040-55678: Clamp Ring, 300MM — wafer clamp ring for mechanical wafer retention in etch process modules.
0021-34402: Heater Assembly, 300MM — resistive heater block for temperature-controlled CVD chamber base.
0040-91234: Baffle, Gas Distribution — secondary gas baffle plate for uniform flow distribution, 300MM PECVD module.
DriveKNMS maintains a dedicated inventory program for Applied Materials 300mm chamber components that have been discontinued by the OEM or are subject to extended lead times through authorized distribution channels. For fabs operating legacy Centura, Producer, or Endura tools beyond their original OEM support window, DriveKNMS provides lifecycle extension sourcing through three primary channels: (1) verified surplus inventory acquired from decommissioned tool sets and fab equipment auctions; (2) cross-reference matching against alternate part numbers and supersession chains for the same functional assembly; and (3) direct procurement coordination with qualified third-party manufacturers producing form-fit-function equivalent assemblies for end-of-life AMAT platforms. All sourced parts are documented with full traceability records including origin, inspection history, and applicable revision level prior to shipment.
Applied Materials 300mm chamber assemblies require specialized inspection protocols due to the precision tolerances involved in vacuum-rated mechanical interfaces and plasma-exposed surfaces. DriveKNMS applies the following verification procedures to all Cover Top Ship Assemblies and related chamber components prior to dispatch: dimensional inspection of all mating flanges and O-ring grooves against OEM drawing tolerances; surface condition assessment for anodized or ceramic-coated surfaces, with rejection criteria applied to any delamination, pitting, or corrosion exceeding process-critical thresholds; helium leak testing on vacuum-interface sub-assemblies where applicable; and cross-verification of part number, revision level, and configuration markings against the customer's tool BOM (Bill of Materials) to confirm compatibility before shipment. Functional test data from the original tool set is retained where available and provided upon request.